SLLSFF5H January 2020 – May 2022 ISO6720-Q1 , ISO6721-Q1 , ISO6721R-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
The ISO672x-Q1 devices are high-performance, dual-channel digital isolators ideal for cost sensitive applications requiring up to 5000 VRMS (DWV package) and 3000 VRMS (D package) isolation ratings per UL 1577. These devices are also certified by VDE, TUV, CSA, and CQC.
The ISO672x-Q1 devices provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI's double capacitive silicon dioxide (SiO2) insulation barrier. The ISO6720-Q1 device has 2 isolation channels with both channels in the same direction. The ISO6721-Q1 device has 2 isolation channels with 1 channel in each direction. In the event of input power or signal loss, the default output is high for devices without suffix F and low for devices with suffix F. See Device Functional Modes section for further details.
PART NUMBER(1) | PACKAGE | BODY SIZE (NOM) |
---|---|---|
ISO6720B-Q1, ISO6720FB-Q1 | D (8) | 4.90 mm x 3.91 mm |
ISO6721B-Q1, ISO6721FB-Q1 | ||
ISO6721RB-Q1, ISO6721RFB-Q1 | ||
ISO6720-Q1, ISO6720F-Q1 | DWV (8) | 5.85 mm x 7.50 mm |
ISO6721-Q1, ISO6721F-Q1 |
Changes from Revision G (January 2022) to Revision H (May 2022)
Changes from Revision F (November 2021) to Revision G (January 2022)
Changes from Revision E (July 2021) to Revision F (November 2021)
Changes from Revision D (April 2021) to Revision E (July 2021)
Changes from Revision C (March 2021) to Revision D (April 2021)
Changes from Revision A (December 2020) to Revision B (January 2021)
Used in conjunction with isolated power supplies, these devices help prevent noise currents on data buses, such as CAN and LIN from damaging sensitive circuitry. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO672x-Q1 devices has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO672x-Q1 family of devices is available in a 8-pin SOIC wide-body (DWV) package and 8-pin SOIC narrow-body (D) package and is a pin-to-pin upgrade to the older generations.
PIN | I/O | DESCRIPTION | |||
---|---|---|---|---|---|
NAME | D and DWV PACKAGE | D PACKAGE | |||
ISO6720-Q1 | ISO6721-Q1 | ISO6721RB-Q1 | |||
GND1 | 4 | 4 | 4 | — | Ground connection for VCC1 |
GND2 | 5 | 5 | 5 | — | Ground connection for VCC2 |
INA | 2 | 7 | 2 | I | Input, channel A |
INB | 3 | 3 | 6 | I | Input, channel B |
OUTA | 7 | 2 | 7 | O | Output, channel A |
OUTB | 6 | 6 | 3 | O | Output, channel B |
VCC1 | 1 | 1 | 1 | — | Power supply, VCC1 |
VCC2 | 8 | 8 | 8 | — | Power supply, VCC2 |