SLLSEX4B August   2019  – June 2022 TLIN1028-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings, IEC Specification
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Supply Characteristics
    7. 7.7 Electrical Charateristics
    8. 7.8 AC Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Circuit: Diagrams and Waveforms
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 LIN Pin
        1. 9.3.1.1 LIN Transmitter Characteristics
        2. 9.3.1.2 LIN Receiver Characteristics
          1. 9.3.1.2.1 Termination
      2. 9.3.2 TXD (Transmit Input)
      3. 9.3.3 RXD (Receive Output)
      4. 9.3.4 VSUP (Supply Voltage)
      5. 9.3.5 GND (Ground)
      6. 9.3.6 EN (Enable Input)
      7. 9.3.7 nRST (Reset Output)
      8. 9.3.8 VCC (Supply Output)
      9. 9.3.9 Protection Features
        1. 9.3.9.1 TXD Dominant Time Out (DTO)
        2. 9.3.9.2 Bus Stuck Dominant System Fault: False Wake Up Lockout
        3. 9.3.9.3 Thermal Shutdown
        4. 9.3.9.4 Under Voltage on VSUP
        5. 9.3.9.5 Unpowered Device and LIN Bus
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Sleep Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Wake-Up Events
        1. 9.4.4.1 Wake-Up Request (RXD)
      5. 9.4.5 Mode Transitions
      6. 9.4.6 Voltage Regulator
        1. 9.4.6.1 VCC
        2. 9.4.6.2 Output Capacitance Selection
        3. 9.4.6.3 Low-Voltage Tracking
        4. 9.4.6.4 Power Supply Recommendation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Normal Mode Application Note
        2. 10.2.1.2 TXD Dominant State Timeout Application Note
        3. 10.2.1.3 Brownout
      2. 10.2.2 Detailed Design Procedures
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 (Grade 1): Qualified for automotive applications
  • Local interconnect network (LIN) physical layer specification ISO/DIS 17987–4 compliant and conforms to SAE J2602 recommended practice for LIN
  • Functional Safety-Capable
  • Supports 12-V applications
  • Wide operating ranges
    • ±58 V LIN bus fault protection
    • LDO output supporting 3.3 V or 5 V
    • Sleep mode: Ultra-low current
      consumption allows wake-up event from:
      • LIN bus or local wake through EN pin
    • Power-up and down glitch-free operation
  • Protection features:
    • ESD protection, VSUP under-voltage protection
    • TXD dominant time out (DTO) protection, Thermal shutdown
    • Unpowered node or ground disconnection fail-safe at system level
  • VCC sources up to 125 mA with DRB and DDA package
  • Available in SOIC (8) and HSOIC (8) packages, and leadless VSON (8) package with improved automated optical inspection (AOI) capability