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TPSM6440xx 3V to 36V, Low IQ, Dual 2/3A Module Optimized for Power Density and Low EMI
SLVSHK8A
December 2023 – June 2024
TPSM64404
,
TPSM64406
,
TPSM64406E
PRODUCTION DATA
CONTENTS
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TPSM6440xx 3V to 36V, Low IQ, Dual 2/3A Module Optimized for Power Density and Low EMI
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
System Characteristics
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Input Voltage Range (VIN1, VIN2)
7.3.2
Enable EN Pin and Use as VIN UVLO
7.3.3
CONFIG Device Configuration Pin
7.3.4
Adjustable Switching Frequency
7.3.5
Spread Spectrum
7.3.6
Adjustable Output Voltage (FB)
7.3.7
Input Capacitors
7.3.8
Output Capacitors
7.3.9
SYNC Allows Clock Synchronization and Mode Selection
7.3.10
Power-Good Output Voltage Monitoring
7.3.11
Bias Supply Regulator (VCC, VOSNS)
7.3.12
Overcurrent Protection (OCP)
7.3.13
Thermal Shutdown
7.4
Device Functional Modes
7.4.1
Shutdown Mode
7.4.2
Standby Mode
7.4.3
Active Mode
8
Applications and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
Design 1 – High-efficiency Dual Output 5 V at 3 A, 3.3 V at 3 A, Synchronous Buck Regulator
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.2.1
Custom Design With WEBENCH® Tools
8.2.1.2.2
Output Voltage Setpoint
8.2.1.2.3
Switching Frequency Selection
8.2.1.2.4
Input Capacitor Selection
8.2.1.2.5
Output Capacitor Selection
8.2.1.2.6
Other Considerations
8.2.1.3
Application Curves
8.2.2
Design 1 – High-efficiency 8-A (10-A peak) Synchronous Buck Regulator for Industrial Applications
8.2.2.1
Design Requirements
8.2.2.2
Detailed Design Procedure
8.2.2.2.1
Output Voltage Setpoint
8.2.2.2.2
Switching Frequency Selection
8.2.2.2.3
Input Capacitor Selection
8.2.2.2.4
Output Capacitor Selection
8.2.2.2.5
Other Connections
8.2.2.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.1.1
Thermal Design and Layout
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.1.1
Third-Party Products Disclaimer
9.1.2
Development Support
9.1.2.1
Custom Design With WEBENCH® Tools
9.2
Documentation Support
9.2.1
Related Documentation
9.3
Receiving Notification of Documentation Updates
9.4
Support Resources
9.5
Trademarks
9.6
Electrostatic Discharge Caution
9.7
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
IMPORTANT NOTICE
Package Options
Mechanical Data (Package|Pins)
RCH|28
MPQF746
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvshk8a_oa
slvshk8a_pm
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