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  • TXV0106-Q1 Automotive 6-Bit Fix Direction Low-Skew,Low-Jitter Voltage Translator or Buffer

    • SCES956B August   2023  – April 2024 TXV0106-Q1

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  • TXV0106-Q1 Automotive 6-Bit Fix Direction Low-Skew,Low-Jitter Voltage Translator or Buffer
  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.2 ± 0.06 V
    7. 5.7  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    8. 5.8  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    9. 5.9  Switching Characteristics, VCCA = 3.3 ± 0.3 V
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 VCC Isolation and VCC Disconnect (Ioff-float)
      4. 7.3.4 Over-Voltage Tolerant Inputs
      5. 7.3.5 Negative Clamping Diodes
      6. 7.3.6 Fully Configurable Dual-Rail Design
      7. 7.3.7 Supports High-Speed Translation
      8. 7.3.8 Wettable Flanks
      9. 7.3.9 Integrated Damping Resistor and Impedance Matching
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Solving Power Sequencing Challenges with the TXV0106-Q1
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
  13. IMPORTANT NOTICE

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
Thermal pad, mechanical data (Package|Pins)
  • BQB|16
    • PPTD365
Orderable Information
  • sces956b_oa
  • sces956b_pm
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Data Sheet

TXV0106-Q1 Automotive 6-Bit Fix Direction Low-Skew,
Low-Jitter Voltage Translator or Buffer

1 Features

  • Configurable design allows each port to operate with a power supply range from 1.14V to 3.6V

  • Supports up to 500Mbps for 1.65V to 3.6V
  • AEC-Q100 qualified for automotive applications
  • Meets RGMII 2.0 timing specifications:
    • < 750ps rise and fall time
    • < ± 5 % duty cycle distortion
    • < ± 400ps channel to channel skew
    • Up to 250Mbps/channel
  • Integrated 10Ω damping output resistor to minimize signal reflections
  • High drive strength (up to 12mA at 3.6V)
  • Fully configurable symmetric dual-rail design
  • Optimal signal integrity performance with 390ps peak-to-peak jitter for 1.8V to 3.3V
  • Features VCC isolation and VCC disconnect
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100mA per JESD 78, Class II
  • ESD protection exceeds JESD 22:
    • 2000V Human-Body Model
    • 1000V Charged-Device Model
  • Low power consumption:
    • 10µA maximum (25°C)
    • 20µA maximum (–40°C to 125°C)
  • Operating temperature from –40°C to +125°C
  • Available in wettable flank WQFN (BQB) package

2 Applications

  • Medium or short range radar
  • ADAS domain controller
  • HVAC controller design
  • Machine vision camera
  • Rack sever motherboard
  • IP telephone

3 Description

The TXV0106-Q1 is a 6-bit, dual-supply fixed-direction low-skew, low jitter voltage translation device. This device can be used for redriving, voltage translation and power isolation when implementing skew sensitive interface, such as RGMII between Ethernet MAC and PHY. The Ax I/O pins and enable pin (OE) are referenced to VCCA logic levels, and Bx I/O pins are referenced to VCCB logic levels. This device has improved channel-to-channel skew, duty cycle distortion and symmetric rise or fall timing for applications requiring strict timing conditions.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, thus preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature is designed so that if either VCC supply is at or near 0V both ports will switch to a high-impedance state. This feature enables power isolation for communications across multiple MACs and PHYs, and is beneficial in situations where MACs and PHYs are powered up asynchronously preventing current backflow between devices.

The TXV0106-Q1 transmits data in a fixed direction from the A bus to the B bus. When OE is set to High, both Ax and Bx pins will be forced into a high-impedance state. See Device Functional Modes for a summary of the operation of the control logic.

Package Information
PART NUMBERPACKAGE(1)PACKAGE SIZE(2)
TXV0106-Q1BQB (WQFN, 16)3.5 mm × 2.5 mm
(1) For more information see, Section 11.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
GUID-20231127-SS0I-NTDV-1HNV-L25SPLHWDPK1-low.svgTXV0106-Q1 in RGMII Applications

4 Pin Configuration and Functions

GUID-20230726-SS0I-D124-RVTJ-WVS1R60VZCKW-low.svg Figure 4-1 BQB Package, 16-Pin WQFN (Top View)
Table 4-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
VCCA1—A-port supply voltage. 1.2V ≤ VCCA ≤ 3.6V.
A12I/OInput/output A1. Referenced to VCCA.
A23I/OInput/output A2. Referenced to VCCA.
A34I/OInput/output A3. Referenced to VCCA.
A45I/OInput/output A4. Referenced to VCCA.
A56I/OInput/output A5. Referenced to VCCA.
A67I/OInput/output A6. Referenced to VCCA.
GND8—Ground.
OE9IOutput Enable. Pull to GND to enable all outputs. Pull to VCCA to place all outputs in high-impedance mode. Referenced to VCCA.
B610I/OInput/output B6. Referenced to VCCB.
B511I/OInput/output B5. Referenced to VCCB.
B412I/OInput/output B4. Referenced to VCCB.
B313I/OInput/output B3. Referenced to VCCB.
B214I/OInput/output B2. Referenced to VCCB.
B115I/OInput/output B1. Referenced to VCCB.
VCCB16—B-port supply voltage. 1.2V ≤ VCCB ≤ 3.6V.
Thermal pad—Thermal pad. Can be grounded (recommended) or left floating.
(1) I = input, O = output

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCCA Supply voltage A –0.5 4.6 V
VCCB Supply voltage B –0.5 4.6 V
VI Input Voltage(2) I/O Ports (A Port) –0.5 4.6 V
I/O Ports (B Port) –0.5 4.6
Control Inputs –0.5 4.6
VO Voltage applied to any output in the high-impedance or power-off state(2) A Port –0.5 4.6 V
B Port –0.5 4.6
VO Voltage applied to any output in the high or low state(2)(3) A Port –0.5 VCCA + 0.5 V
B Port –0.5 VCCB + 0.5
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current –50 50 mA
Continuous current through VCC or GND –100 100 mA
Tj Junction Temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Rating may cause permanent device damage. Absolute Maximum Rating do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Condition. If used outside the Recommended Operating Condition but within the Absolute Maximum Rating, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed.

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) HBM ESD classification level 2 ±2000 V
Charged device model (CDM), per AEC Q100-011 CDM ESD classification level C3 ±1000 V
(1) AEC Q100-002 indicates that HBM stressing must be in accordance with the ANSI/ESDA/JEDEC JS-001 specification

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCCA Supply voltage A 1.14 3.6 V
VCCB Supply voltage B  1.14 3.6 V
VIH High-level input voltage  Data Inputs (Ax, Bx), OE
(Referenced to VCCI)		  VCCI = 1.14 V - 3.6 V VCCI x 0.7 V
VIL Low-level input voltage Data Inputs (Ax, Bx), OE
(Referenced to VCCI)		  VCCI = 1.14 V - 3.6 V VCCI x 0.3 V
IOH High-level output current VCCO = 1.14 V –3 mA
VCCO = 1.65 V - 1.95 V –8
VCCO = 2.3 V - 2.7 V –9
VCCO = 3 V - 3.6 V –12
IOL Low-level output current VCCO = 1.14 V 3 mA
VCCO = 1.65 V - 1.95 V 8
VCCO = 2.3 V - 2.7 V 9
VCCO = 3 V - 3.6 V 12
VI Input voltage 0 3.6 V
VO Output voltage Active State 0 VCCO V
Tri-State 0 3.6
Δt/Δv Input transition rise and fall time 5 ns/V
TA Operating free-air temperature –40 125 °C
(1) VCCI is the VCC associated with the input port. VCCO is the VCC associated with the output port.

5.4 Thermal Information

THERMAL METRIC(1) TXV0106 / TXV0106-Q1 UNIT
BQB (WQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 71.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 64.5 °C/W
RθJB Junction-to-board thermal resistance 41.5 °C/W
YJT Junction-to-top characterization parameter 4.5 °C/W
YJB Junction-to-board characterization parameter 41.5 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance 20.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics app report.

5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)(1) (2)
PARAMETER TEST CONDITIONS VCCA VCCB Operating free-air temperature (TA) UNIT
–40°C to 125°C
MIN TYP MAX
VIL Data Input_Negative threshold Data inputs, OE 1.14 V - 3.6 V 1.14 V - 3.6 V 0.3× VCCA V
VIH Data Input_Positive threshold Data inputs, OE 1.14 V - 3.6 V 1.14 V - 3.6 V 0.7× VCCA V
VOH High-level output voltage (3)  IOH = –3 mA 1.14  V 1.14 V 0.9 V
IOH = –8 mA 1.65 V 1.65 V 1.1
IOH = –9 mA 2.3 V 2.3 V 1.8
IOH = –12 mA 3 V 3 V 2.4
VOL Low-level output voltage (4)  IOL = 3 mA 1.14 V 1.14 V 0.1 V
IOL = 8 mA 1.65 V 1.65 V 0.27
IOL = 9 mA 2.3 V 2.3 V 0.23
IOL = 12 mA 3 V 3 V 0.26
II Input leakage current Data Inputs
(Ax, Bx)
VI = VCCI or GND		 1.14 V - 3.6 V 1.14 V - 3.6 V –1 1 µA
Ioff Partial power down current A Port or B Port
VI or VO = 0 V - 3.6 V		 0 V 0 V - 3.6 V –5 3.6 µA
0 V - 3.6 V 0 V –5 3.6
IOZ Tri-state output current (5) A or B Port:
VI = VCCI or GND
VO = VCCO or GND
OE = VIH		 3.6 V 3.6 V –5 5 µA
ICCA VCCA supply current VI = VCCI or GND
IO = 0		 1.14 V - 3.6 V 1.14 V - 3.6 V 14 µA
3.6 V 0 V 11
0 V 3.6 V -1
ICCB VCCB supply current VI = VCCI or GND
IO = 0		 1.14 V - 3.6 V 1.14 V - 3.6 V 14 µA
3.6 V 0 V –1
0 V 3.6 V 11
ICCA + ICCB Combined supply current VI = VCCI or GND
IO = 0		 1.14 V - 3.6 V 1.14 V - 3.6 V 22 µA
Ci Control Input Capacitance VI = 3.3 V or GND 3.3 V 3.3 V 3.9 pF
Cio Data I/O Capacitance OE = VCCA, VO = 1.65V DC +1 MHz -16 dBm sine wave 3.3 V 3.3 V 2.7 pF
(1) VCCI is the VCC associated with the input port.
(2) VCCO is the VCC associated with the output port.
(3) Tested at VI = VIH.
(4) Tested at VI = VIL.
(5) For I/O ports, the parameter IOZ includes the input leakage current.

5.6 Switching Characteristics, VCCA = 1.2 ± 0.06 V

Over the recommended temperature range at CL = 5 pF, unless otherwise indicated.
PARAMETER FROM TO B-Port Supply Voltage (VCCB) UNIT
1.2V ± 0.06 1.8 ± 0.15 V 2.5 ± 0.2 V 3.3 ± 0.3 V
TYP TYP TYP TYP
tpd Propagation delay A B 4.5 3.0 2.5 2.5 ns
tdis Disable time  OE B 7.5 6.5 6.0 6.0 ns
ten Enable time OE B 9 7 6.5 6.5 ns
TR Rise time (1) A B 0.75 0.40 0.30 0.25 ns
TF Fall time (1) A B 0.65 0.40 0.30 0.30 ns
Duty Cycle Duty cycle variation A B 50 50 50 50 %
(1) Rise and fall time is measured at 20% - 80%

5.7 Switching Characteristics, VCCA = 1.8 ± 0.15 V

Minimum and maximum limits apply over the recommended temperature range at CL = 15 pF and 250 Mbps, unless otherwise indicated.
PARAMETER FROM TO B-Port Supply Voltage (VCCB) UNIT
1.8 ± 0.15 V 2.5 ± 0.2 V 3.3 ± 0.3 V
MIN TYP MAX MIN TYP MAX MIN TYP MAX
tpd Propagation delay A B 1.5 4.8 1.2 3.5 1.2 3.0 ns
tdis Disable time OE B 3.5 7.0 3.0 5.5 3.6 6.5 ns
ten Enable time OE B 1.2 4.0 1.0 3.0 1.0 2.6 ns
tSKO Output channel-to-channel skew (1) A B -450 450 -300 300 -330 330 ps
TR Rise time (2) A B 0.49 1.35 0.40 0.95 0.35 0.80 ns
TF Fall time (2) A B 0.45 1.35 0.35 0.95 0.35 0.80 ns
Duty Cycle Duty cycle variation A B 47 50 56 47 50 54 47 50 54 %
TR_5pF Rise time (2) (3) A B 0.28 0.75 0.22 0.55 0.19 0.45 ns
TF_5pF Fall time (2) (3) A B 0.27 0.75 0.20 0.55 0.18 0.40 ns
tSKO_5pF Output channel-to-channel skew (1) (3) A B -300 300 -270 270 -310 310 ps
Duty Cycle_5pF Duty cycle variation (3) A B 47 50 54 47 50 54 47 50 54 %
tjit(pp) Peak-to-peak jitter (250 Mbps 215- 1 PRBS input) A B 160 450 130 335 120 390 ps
(1) Skew parameter also includes jitter
(2) Rise and fall time is measured at 20% - 80%
(3) Parameters tested under RGMII input transition (≤ 2 ns/V) rise and fall time. CLOAD = 5pF

 
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