ZHCSF08B
May 2016 – February 2022
CSD18541F5
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Specifications
5.1
Electrical Characteristics
5.2
Thermal Information
5.3
Typical MOSFET Characteristics
6
Device and Documentation Support
6.1
Receiving Notification of Documentation Updates
6.2
Community Resources
6.3
Trademarks
7
Mechanical, Packaging, and Orderable Information
7.1
Mechanical Dimensions
7.2
Recommended Minimum PCB Layout
7.3
Recommended Stencil Pattern
封装选项
机械数据 (封装 | 引脚)
YJK|3
MXLG029B
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsf08b_oa
zhcsf08b_pm
1
特性
低导通电阻
超低 Q
g
和 Q
gd
超小尺寸
1.53mm × 0.77mm
薄型封装
厚度为 0.36mm
集成型 ESD 保护二极管
无铅且无卤素
符合 RoHS