ZHCSHW7C
february 2018 – july 2023
DLP3010
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
6.8
Switching Characteristics
6.9
System Mounting Interface Loads
6.10
Micromirror Array Physical Characteristics
6.11
Micromirror Array Optical Characteristics
6.12
Window Characteristics
6.13
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power Interface
7.3.2
Low-Speed Interface
7.3.3
High-Speed Interface
7.3.4
Timing
7.4
Device Functional Modes
7.5
Optical Interface and System Image Quality Considerations
7.5.1
Numerical Aperture and Stray Light Control
7.5.2
Pupil Match
7.5.3
Illumination Overfill
7.6
Micromirror Array Temperature Calculation
7.7
Micromirror Power Density Calculation
7.8
Micromirror Landed-On/Landed-Off Duty Cycle
7.8.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7.8.2
Landed Duty Cycle and Useful Life of the DMD
7.8.3
Landed Duty Cycle and Operational DMD Temperature
7.8.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
9
Power Supply Recommendations
9.1
Power Supply Power-Up Procedure
9.2
Power Supply Power-Down Procedure
9.3
Power Supply Sequencing Requirements
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
第三方产品免责声明
11.1.2
Device Nomenclature
11.1.3
Device Markings
11.2
Related Links
11.3
接收文档更新通知
11.4
支持资源
11.5
Trademarks
11.6
静电放电警告
11.7
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
FQK|57
MCLG029B
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcshw7c_oa
Data Sheet
DLP3010
0.3 720p DMD