SNAS500Q May   2010  – May 2017 ADC12D1800

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Pin Configuration and Functions
    1. 3.1 Pin Attributes
  4. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Converter Electrical Characteristics: Static Converter Characteristics
    6. 4.6  Converter Electrical Characteristics: Dynamic Converter Characteristics
    7. 4.7  Converter Electrical Characteristics: Analog Input and Output and Reference Characteristics
    8. 4.8  Converter Electrical Characteristics: I-Channel to Q-Channel Characteristics
    9. 4.9  Converter Electrical Characteristics: Sampling Clock Characteristics
    10. 4.10 Converter Electrical Characteristics: AutoSync Feature Characteristics
    11. 4.11 Converter Electrical Characteristics: Digital Control and Output Pin Characteristics
    12. 4.12 Converter Electrical Characteristics: Power Supply Characteristics
    13. 4.13 Converter Electrical Characteristics: AC Electrical Characteristics
    14. 4.14 Converter Timing Requirements: Serial Port Interface
    15. 4.15 Converter Switching Characteristics: Calibration
    16. 4.16 Typical Characteristics
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 Input Control and Adjust
        1. 5.3.1.1 AC/DC-coupled Mode
        2. 5.3.1.2 Input Full-Scale Range Adjust
        3. 5.3.1.3 Input Offset Adjust
        4. 5.3.1.4 DES Timing Adjust
        5. 5.3.1.5 Sampling Clock Phase (Aperture) Delay Adjust
      2. 5.3.2 Output Control and Adjust
        1. 5.3.2.1 DDR Clock Phase
        2. 5.3.2.2 LVDS Output Differential Voltage
        3. 5.3.2.3 LVDS Output Common-Mode Voltage
        4. 5.3.2.4 Output Formatting
        5. 5.3.2.5 Test Pattern Mode
        6. 5.3.2.6 Time Stamp
      3. 5.3.3 Calibration Feature
        1. 5.3.3.1 Calibration Control Pins and Bits
        2. 5.3.3.2 How to Execute a Calibration
        3. 5.3.3.3 Power-on Calibration
        4. 5.3.3.4 On-Command Calibration
        5. 5.3.3.5 Calibration Adjust
        6. 5.3.3.6 Read/Write Calibration Settings
        7. 5.3.3.7 Calibration and Power-Down
        8. 5.3.3.8 Calibration and the Digital Outputs
      4. 5.3.4 Power Down
    4. 5.4 Device Functional Modes
      1. 5.4.1 DES/Non-DES Mode
      2. 5.4.2 Demux/Non-Demux Mode
    5. 5.5 Programming
      1. 5.5.1 Control Modes
        1. 5.5.1.1 Non-Extended Control Mode
          1. 5.5.1.1.1  Dual Edge Sampling Pin (DES)
          2. 5.5.1.1.2  Non-Demultiplexed Mode Pin (NDM)
          3. 5.5.1.1.3  Dual Data Rate Phase Pin (DDRPh)
          4. 5.5.1.1.4  Calibration Pin (CAL)
          5. 5.5.1.1.5  Calibration Delay Pin (CalDly)
          6. 5.5.1.1.6  Power Down I-channel Pin (PDI)
          7. 5.5.1.1.7  Power Down Q-channel Pin (PDQ)
          8. 5.5.1.1.8  Test Pattern Mode Pin (TPM)
          9. 5.5.1.1.9  Full-Scale Input Range Pin (FSR)
          10. 5.5.1.1.10 AC/DC-Coupled Mode Pin (VCMO)
          11. 5.5.1.1.11 LVDS Output Common-mode Pin (VBG)
        2. 5.5.1.2 Extended Control Mode
          1. 5.5.1.2.1 Serial Interface
    6. 5.6 Register Maps
      1. 5.6.1 Register Definitions
  6. 6 Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Analog Inputs
        1. 6.1.1.1 Acquiring the Input
        2. 6.1.1.2 Driving the ADC in DES Mode
        3. 6.1.1.3 FSR and the Reference Voltage
        4. 6.1.1.4 Out-of-Range Indication
        5. 6.1.1.5 Maximum Input Range
        6. 6.1.1.6 AC-Coupled Input Signals
        7. 6.1.1.7 DC-Coupled Input Signals
        8. 6.1.1.8 Single-Ended Input Signals
      2. 6.1.2 Clock Inputs
        1. 6.1.2.1 CLK Coupling
        2. 6.1.2.2 CLK Frequency
        3. 6.1.2.3 CLK Level
        4. 6.1.2.4 CLK Duty Cycle
        5. 6.1.2.5 CLK Jitter
        6. 6.1.2.6 CLK Layout
      3. 6.1.3 LVDS Outputs
        1. 6.1.3.1 Common-mode and Differential Voltage
        2. 6.1.3.2 Output Data Rate
        3. 6.1.3.3 Terminating Unused LVDS Output Pins
      4. 6.1.4 Synchronizing Multiple ADC12D1800S in a System
        1. 6.1.4.1 AutoSync Feature
        2. 6.1.4.2 DCLK Reset Feature
      5. 6.1.5 Recommended System Chips
        1. 6.1.5.1 Temperature Sensor
        2. 6.1.5.2 Clocking Device
        3. 6.1.5.3 Amplifiers for Analog Input
        4. 6.1.5.4 Balun Recommendations for Analog Input
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
      3. 6.2.3 Application Curves
  7. 7 Power Supply Recommendations
    1. 7.1 System Power-on Considerations
      1. 7.1.1 Power-on, Configuration, and Calibration
      2. 7.1.2 Power-on and Data Clock (DCLK)
  8. 8 Layout
    1. 8.1 Layout Guidelines
      1. 8.1.1 Power Planes
      2. 8.1.2 Bypass Capacitors
      3. 8.1.3 Ground Planes
      4. 8.1.4 Power System Example
    2. 8.2 Layout Example
    3. 8.3 Thermal Management
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Specification Definitions
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Community Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

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订购信息

1 Device Overview

1.1 Features

  • Configurable to Either 3.6 GSPS Interleaved or 1.8 GSPS Dual ADC
  • Pin-Compatible with ADC10D1000/1500 and ADC12D1000/1600
  • Internally Terminated, Buffered, Differential Analog Inputs
  • Interleaved Timing Automatic and Manual Skew Adjust
  • Test Patterns at Output for System Debug
  • Programmable 15-bit Gain and 12-bit Plus Sign Offset
  • Programmable tAD Adjust Feature
  • 1:1 Non-Demuxed or 1:2 Demuxed LVDS Outputs
  • AutoSync Feature for Multi-Chip Systems
  • Single 1.9-V ± 0.1-V Power Supply
  • Key Specifications
    • Resolution: 12 Bits
    • Interleaved 3.6 GSPS ADC
      • Noise Floor Density –153.5 dBm/Hz (typ)
      • IMD3 –61 dBFS (typ)
      • Noise Power Ratio 48.5 dB (typ)
      • Power 4.4 W (typ)
      • Full Power Bandwidth 1.75 GHz (typ)
    • Dual 1.8 GSPS ADC, Fin = 125MHz
      • ENOB: 9.4 (typ)
      • SNR 58.5 dB (typ)
      • SFDR 73 dBc (typ)
      • Power 4.4 W (typ)
      • Full Power Bandwidth 2.8 GHz (typ)

1.2 Applications

  • Wideband Communications
  • Data Acquisition Systems
  • RADAR/LIDAR
  • Set-top Box
  • Consumer RF
  • Software Defined Radio

1.3 Description

The 12-bit, 3.6 GSPS ADC12D1800 is the latest advance in TI's Ultra-High-Speed ADC family and builds upon the features, architecture and functionality of the 10-bit GHz family of ADCs.

The ADC12D1800 provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and supports programmable common mode voltage.

The product is packaged in a leaded or lead-free 292-ball thermally enhanced BGA package over the rated industrial temperature range of –40°C to +85°C.

To achieve full rated performance for fCLK > 1.6 GHz, write the maximum power settings one time to Register 6h through the serial interface; see Section 5.6.1 for more information.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
ADC12D1800 BGA (292) 27.00 mm × 27.00 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.

1.4 Functional Block Diagram

ADC12D1800 30123211.png Figure 1-1 Functional Block Diagram