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CC1350 SimpleLink™ 超低功耗 双频带无线 MCU
ZHCSFA6B
June 2016 – July 2018
CC1350
PRODUCTION DATA.
CONTENTS
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CC1350 SimpleLink™ 超低功耗 双频带无线 MCU
1
器件概述
1.1
特性
1.2
应用
1.3
说明
1.4
功能框图
2
修订历史记录
3
Device Comparison
3.1
Related Products
4
Terminal Configuration and Functions
4.1
Pin Diagram – RSM Package
4.2
Signal Descriptions – RSM Package
4.3
Pin Diagram – RHB Package
4.4
Signal Descriptions – RHB Package
4.5
Pin Diagram – RGZ Package
4.6
Signal Descriptions – RGZ Package
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Power Consumption Summary
5.5
RF Characteristics
5.6
Receive (RX) Parameters, 861 MHz to 1054 MHz
5.7
Receive (RX) Parameters, 431 MHz to 527 MHz
5.8
Transmit (TX) Parameters, 861 MHz to 1054 MHz
5.9
Transmit (TX) Parameters, 431 MHz to 527 MHz
5.10
1-Mbps GFSK (Bluetooth low energy) – RX
5.11
1-Mbps GFSK (Bluetooth low energy) – TX
5.12
PLL Parameters
5.13
ADC Characteristics
5.14
Temperature Sensor
5.15
Battery Monitor
5.16
Continuous Time Comparator
5.17
Low-Power Clocked Comparator
5.18
Programmable Current Source
5.19
DC Characteristics
5.20
Thermal Characteristics
5.21
Timing and Switching Characteristics
5.21.1
Reset Timing
Table 5-1
Reset Timing
5.21.2
Wakeup Timing
Table 5-2
Wakeup Timing
5.21.3
Clock Specifications
Table 5-3
24-MHz Crystal Oscillator (XOSC_HF)
Table 5-4
32.768-kHz Crystal Oscillator (XOSC_LF)
Table 5-5
48-MHz RC Oscillator (RCOSC_HF)
Table 5-6
32-kHz RC Oscillator (RCOSC_LF)
5.21.4
Flash Memory Characteristics
Table 5-7
Flash Memory Characteristics
5.21.5
Synchronous Serial Interface (SSI) Characteristics
Table 5-8
Synchronous Serial Interface (SSI) Characteristics
5.22
Typical Characteristics
5.23
Typical Characteristics – Sub-1 GHz
5.24
Typical Characteristics – 2.4 GHz
6
Detailed Description
6.1
Overview
6.2
Main CPU
6.3
RF Core
6.4
Sensor Controller
6.5
Memory
6.6
Debug
6.7
Power Management
6.8
Clock Systems
6.9
General Peripherals and Modules
6.10
Voltage Supply Domains
6.11
System Architecture
7
Application, Implementation, and Layout
7.1
Application Information
7.2
TI Design or Reference Design
8
器件和文档支持
8.1
器件命名规则
8.2
工具和软件
8.3
文档支持
8.4
德州仪器 (TI) 低功耗射频网站
8.5
其他信息
8.6
社区资源
8.7
商标
8.8
静电放电警告
8.9
出口管制提示
8.10
术语表
9
机械、封装和可订购信息
9.1
封装信息
重要声明
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
RSM|32
RGZ|48
RHB|32
散热焊盘机械数据 (封装 | 引脚)
RGZ|48
QFND031W
RSM|32
QFND112H
RHB|32
QFND029X
订购信息
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CC1350 SimpleLink™ 超低功耗 双频带无线 MCU
本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。
1
器件概述