ZHCSNL5A
March 2021 – May 2022
DLP650TE
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
11
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Switching Characteristics
15
6.8
Timing Requirements
17
6.9
System Mounting Interface Loads
19
6.10
Micromirror Array Physical Characteristics
21
6.11
Micromirror Array Optical Characteristics
23
6.12
Window Characteristics
6.13
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power Interface
7.3.2
Timing
7.4
Device Functional Modes
7.5
Optical Interface and System Image Quality Considerations
7.5.1
Numerical Aperture and Stray Light Control
7.5.2
Pupil Match
7.5.3
Illumination Overfill
7.6
Micromirror Array Temperature Calculation
7.7
Micromirror Landed-On/Landed-Off Duty Cycle
7.7.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7.7.2
Landed Duty Cycle and Useful Life of the DMD
7.7.3
Landed Duty Cycle and Operational DMD Temperature
7.7.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Temperature Sensor Diode
9
Power Supply Recommendations
9.1
Power Supply Sequence Requirements
9.2
DMD Power Supply Power-Up Procedure
9.3
DMD Power Supply Power-Down Procedure
10
Layout
10.1
Layout Guidelines
10.2
Impedance Requirements
10.3
Layers
10.4
Trace Width, Spacing
10.5
Power
10.6
Trace Length Matching Recommendations
11
Device and Documentation Support
11.1
第三方产品免责声明
11.2
Device Support
11.2.1
Device Nomenclature
11.2.2
Device Markings
11.3
Documentation Support
11.3.1
Related Documentation
11.4
接收文档更新通知
11.5
支持资源
11.6
Trademarks
11.7
Electrostatic Discharge Caution
11.8
术语表
12
Mechanical, Packaging, and Orderable Information
12.1
Package Option Addendum
12.1.1
Packaging Information
封装选项
机械数据 (封装 | 引脚)
FYP|149
MCLG039
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsnl5a_oa
1
DLP650TE 0.65 4-K UHD DMD