ZHCSNO0B
April 2021 – November 2021
DP83561-SP
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
5.1
Pin States
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.6.1
Timing Requirement Diagrams
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.1.1
Engineering Model (Parts With /EM Suffix)
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Copper Ethernet
7.3.1.1
1000BASE-T
7.3.1.2
100BASE-TX
7.3.1.3
10BASE-Te
7.3.2
MAC Interfaces
7.3.2.1
Reduced GMII (RGMII)
7.3.2.1.1
RGMII-TX Requirements
7.3.2.1.2
RGMII-RX Requirements
7.3.2.1.3
1000-Mbps Mode Operation
7.3.2.1.4
1000-Mbps Mode Timing
7.3.2.1.5
10- and 100-Mbps Mode
7.3.2.2
Media Independent Interface (MII)
7.3.3
Auto-Negotiation
7.3.3.1
Speed and Duplex Selection - Priority Resolution
7.3.3.2
Master and Slave Resolution
7.3.3.3
Pause and Asymmetrical Pause Resolution
7.3.3.4
Next Page Support
7.3.3.5
Parallel Detection
7.3.3.6
Restart Auto-Negotiation
7.3.3.7
Enabling Auto-Negotiation Through Software
7.3.3.8
Auto-Negotiation Complete Time
7.3.3.9
Auto-MDIX Resolution
7.3.4
Speed Optimization
7.3.5
Radiation Performance
7.3.5.1
Total Ionizing Dose (TID)
7.3.5.2
Single-Event Effects (SEE)
7.3.5.3
Single Event Functional Interrupt (SEFI) Monitor Suite
7.3.5.3.1
PCS State Machine Monitors
7.3.5.3.2
Configuration Register Monitors
7.3.5.3.3
Temperature Monitor
7.3.5.3.4
PLL Lock Monitor
7.3.6
WoL (Wake-on-LAN) Packet Detection
7.3.6.1
Magic Packet Structure
7.3.6.2
Magic Packet Example
7.3.6.3
Wake-on-LAN Configuration and Status
7.3.7
Start of Frame Detect for IEEE 1588 Time Stamp
7.3.7.1
SFD Latency Variation and Determinism
7.3.7.1.1
1000M SFD Variation in Master Mode
7.3.7.1.2
1000M SFD Variation in Slave Mode
7.3.7.1.3
100M SFD Variation
7.3.8
Cable Diagnostics
7.3.8.1
TDR
7.3.8.2
Fast Link Drop
7.3.8.3
Fast Link Detect
7.3.8.4
Energy Detect
7.3.8.5
IEEE 802.3 Test Modes
7.3.8.6
Jumbo Frames
7.3.9
Clock Output
7.4
Device Functional Modes
7.4.1
Mirror Mode
7.4.2
Loopback Mode
7.4.2.1
Near-End Loopback
7.4.2.1.1
MII Loopback
7.4.2.1.2
PCS Loopback
7.4.2.1.3
Digital Loopback
7.4.2.1.4
Analog Loopback
7.4.2.1.5
External Loopback
7.4.2.1.6
Far-End (Reverse) Loopback
7.4.2.2
Loopback Availability Exception
7.4.3
Power-Saving Modes
7.4.3.1
IEEE Power Down
7.4.3.2
Deep Power-Down Mode
7.4.3.3
Active Sleep
7.4.3.4
Passive Sleep
7.5
Programming
7.5.1
Serial Management Interface
7.5.1.1
Extended Address Space Access
7.5.1.1.1
Write Address Operation
7.5.1.1.2
Read Address Operation
7.5.1.1.3
Write (No Post Increment) Operation
7.5.1.1.4
Read (No Post Increment) Operation
7.5.1.1.5
Write (Post Increment) Operation
7.5.1.1.6
Read (Post Increment) Operation
7.5.1.1.7
Example of Read Operation Using Indirect Register Access
7.5.1.1.8
Example of Write Operation Using Indirect Register Access
7.5.2
Interrupt
7.5.3
BIST Configuration
7.5.4
Strap Configuration
7.5.5
LED Configuration
7.5.6
LED Operation From 1.8-V I/O VDD Supply
7.5.7
Reset Operation
7.5.7.1
Hardware Reset
7.5.7.2
IEEE Software Reset
7.5.7.3
Global Software Reset
7.5.7.4
Global Software Restart
7.5.7.5
PCS Restart
7.6
Register Maps
7.6.1
DP83561SP Registers
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Clock Input
8.2.2.1.1
Crystal Recommendations
8.2.2.1.2
External Clock Source Recommendations
8.2.2.2
MAC Interface
8.2.2.2.1
RGMII Layout Guidelines
8.2.2.2.2
MII Layout Guidelines
8.2.2.3
Media Dependent Interface (MDI)
8.2.2.3.1
MDI Layout Guidelines
8.2.2.4
Magnetics Requirements
8.2.2.4.1
Magnetics Connection
9
Power Supply Recommendations
9.1
Two-Supply Configuration
9.2
Three-Supply Configuration
10
Layout
10.1
Layout Guidelines
10.1.1
Signal Traces
10.1.2
Return Path
10.1.3
Transformer Layout
10.1.4
Metal Pour
10.1.5
PCB Layer Stacking
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
接收文档更新通知
11.3
支持资源
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
HBE|64
MCCF006A
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsno0b_oa
zhcsno0b_pm
1
特性
QML V 类 (QMLV)、RHA、SMD 5962-20216
军用温度范围-55°C 至 125°C
辐射性能
RHA 高达 TID = 300krad (Si)
SEL 对于 LET 的抗扰度 = 121MeV-cm
2
/mg
单粒子功能中断 (SEFI) 监测套件
显示器
IEEE PCS 状态机监测
ECC 配置寄存器监测
PLL 锁定监测
片上温度监测
操作
用于监测事件的中断引脚
校正
受 ECC 保护的配置寄存器
引脚可配置自动 SEFI 恢复
串行管理接口 (SMI) 禁用
完全兼容 IEEE 802.3 10BASE-T、100BASE-TX 以及 1000BASE-Te 规范
低 RGMII 延迟(TX < 90ns,RX < 290ns)
符合时间敏感网络标准
MAC 接口:RGMII、MII
集成 MDI 终端电阻器
可编程 RGMII 终端阻抗
电源:2.5V、1.8V、1.1V
I/O 电压:1.8V、2.5V 和 3.3V
25MHz 或 125MHz 同步时钟输出
电缆诊断:基于 TDR 的开路和短路诊断
JTAG 支持