ZHCSJG5C
March 2019 – September 2021
MSP430FR2475
,
MSP430FR2476
PRODUCTION DATA
1
特性
2
应用
3
说明
4
功能模块图
5
Revision History
6
Device Comparison
6.1
Related Products
7
Terminal Configuration and Functions
7.1
Pin Diagrams
7.2
Pin Attributes
7.3
Signal Descriptions
7.4
Pin Multiplexing
7.5
Buffer Types
7.6
Connection of Unused Pins
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Active Mode Supply Current Into VCC Excluding External Current
8.5
Active Mode Supply Current Per MHz
8.6
Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
8.7
Low-Power Mode (LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
8.8
Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
8.9
Typical Characteristics – Low-Power Mode Supply Currents
8.10
Current Consumption Per Module
8.11
Thermal Resistance Characteristics
8.12
Timing and Switching Characteristics
8.12.1
Power Supply Sequencing
8.12.1.1
PMM, SVS and BOR
8.12.2
Reset Timing
8.12.2.1
Wake-up Times From Low-Power Modes and Reset
8.12.3
Clock Specifications
8.12.3.1
XT1 Crystal Oscillator (Low Frequency)
8.12.3.2
DCO FLL, Frequency
8.12.3.3
DCO Frequency
8.12.3.4
REFO
8.12.3.5
Internal Very-Low-Power Low-Frequency Oscillator (VLO)
8.12.3.6
Module Oscillator (MODOSC)
8.12.4
Digital I/Os
8.12.4.1
Digital Inputs
8.12.4.2
Digital Outputs
8.12.4.3
Typical Characteristics – Outputs at 3 V and 2 V
8.12.5
Internal Shared Reference
8.12.5.1
Internal Reference Characteristics
8.12.6
Timer_A and Timer_B
8.12.6.1
Timer_A
8.12.6.2
Timer_B
8.12.7
eUSCI
8.12.7.1
eUSCI (UART Mode) Clock Frequency
8.12.7.2
eUSCI (UART Mode) Timing Characteristics
8.12.7.3
eUSCI (SPI Master Mode) Clock Frequency
8.12.7.4
eUSCI (SPI Master Mode)
8.12.7.5
eUSCI (SPI Slave Mode)
8.12.7.6
eUSCI (I2C Mode)
8.12.8
ADC
8.12.8.1
ADC, Power Supply and Input Range Conditions
8.12.8.2
ADC, Timing Parameters
8.12.8.3
ADC, Linearity Parameters
8.12.9
Enhanced Comparator (eCOMP)
8.12.9.1
eCOMP0 Characteristics
8.12.10
FRAM
8.12.10.1
FRAM Characteristics
8.12.11
Debug and Emulation
8.12.11.1
JTAG, 4-Wire and Spy-Bi-Wire Interface
9
Detailed Description
9.1
Overview
9.2
CPU
9.3
Operating Modes
9.4
Interrupt Vector Addresses
9.5
Bootloader (BSL)
9.6
JTAG Standard Interface
9.7
Spy-Bi-Wire Interface (SBW)
9.8
FRAM
9.9
Memory Protection
9.10
Peripherals
9.10.1
Power-Management Module (PMM)
9.10.2
Clock System (CS) and Clock Distribution
9.10.3
General-Purpose Input/Output Port (I/O)
9.10.4
Watchdog Timer (WDT)
9.10.5
System (SYS) Module
9.10.6
Cyclic Redundancy Check (CRC)
9.10.7
Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
9.10.8
Timers (TA0, TA1, TA2, TA3 and TB0)
9.10.9
Hardware Multiplier (MPY)
9.10.10
Backup Memory (BAKMEM)
9.10.11
Real-Time Clock (RTC)
9.10.12
12-Bit Analog-to-Digital Converter (ADC)
9.10.13
eCOMP0
9.10.14
Embedded Emulation Module (EEM)
9.11
Input/Output Diagrams
9.11.1
Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
9.11.2
Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
9.11.3
Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
9.11.4
Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
9.11.5
Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
9.11.6
Port P6 (P6.0 to P6.2) Input/Output With Schmitt Trigger
9.12
Device Descriptors
9.13
Memory
9.13.1
Memory Organization
9.13.2
Peripheral File Map
9.14
Identification
9.14.1
Revision Identification
9.14.2
Device Identification
9.14.3
JTAG Identification
10
Applications, Implementation, and Layout
10.1
Device Connection and Layout Fundamentals
10.1.1
Power Supply Decoupling and Bulk Capacitors
10.1.2
External Oscillator
10.1.3
JTAG
10.1.4
Reset
10.1.5
Unused Pins
10.1.6
General Layout Recommendations
10.1.7
Do's and Don'ts
10.2
Peripheral- and Interface-Specific Design Information
10.2.1
ADC Peripheral
10.2.1.1
Partial Schematic
10.2.1.2
Design Requirements
10.2.1.3
Layout Guidelines
11
Device and Documentation Support
11.1
Getting Started and Next Steps
11.2
Device Nomenclature
11.3
Tools and Software
11.4
Documentation Support
11.5
支持资源
11.6
Trademarks
11.7
Electrostatic Discharge Caution
11.8
Export Control Notice
11.9
术语表
12
Mechanical, Packaging, and Orderable Information
1
特性
嵌入式微控制器
16 位 RISC 架构
支持的时钟频率最高可达 16MHz
1.8 V 至 3.6 V 的宽电源电压范围(最低电源电压受限于 SVS 电平,请参阅
SVS 规格
)
优化的超低功耗模式
工作模式:135µA/MHz(典型值)
待机:
采用 32768Hz 晶振的 LPM3.5 实时时钟 (RTC) 计数器:660nA(典型值)
关断 (LPM4.5):37nA,未使用 SVS
低功耗铁电 RAM (FRAM)
容量高达 64KB 的非易失性存储器
内置错误修正码 (ECC)
可配置的写保护
对程序、常量和存储的统一存储
耐写次数达 10
15
次
抗辐射和非磁性
智能数字外设
四个 16 位计时器,每个计时器有 3 个捕捉/比较寄存器 (Timer_A3)
一个 16 位计时器,具有 7 个捕捉/比较寄存器 (Timer_B7)
一个仅用作计数器的 16 位 RTC
16 位循环冗余校验 (CRC)
增强型串行通信,支持引脚重映射功能
两个 eUSCI_A 接口,支持 UART、IrDA 和 SPI
两个 eUSCI_B 接口,支持 SPI 和 I
2
C
高性能模拟
高达 12 通道 12 位模数转换器 (ADC)
内部共享基准(1.5、2.0 或 2.5V)
采样与保持 200ksps
一个增强型比较器 (eCOMP)
集成 6 位 DAC 作为基准电压
可编程迟滞
可配置的高功率和低功率模式
时钟系统 (CS)
片上 32kHz RC 振荡器 (REFO),具有 1µA 支持
带有锁频环 (FLL) 的片上 16MHz 数控振荡器 (DCO)
室温下的精度为 ±1%(具有片上基准)
片上超低频 10kHz 振荡器 (VLO)
片上高频调制振荡器 (MODOSC)
外部 32kHz 晶振 (LFXT)
可编程 MCLK 预分频器(1 至 128)
通过可编程预分频器(1、2、4 或 8)从 MCLK 获得的 SMCLK
通用输入/输出和引脚功能
LQFP-48 封装上的 43 个 I/O
所有 GPIO 上的 43 个中断引脚可以将 MCU 从低功耗模式下唤醒
开发工具和软件
开发工具
目标开发板
MSP‑TS430PT48A
LaunchPad™ 开发套件
LP‑MSP430FR2476
系列成员(另请参阅
器件比较
)
MSP430FR2476:64KB 程序 FRAM、512B 信息 FRAM、8KB RAM
MSP430FR2475:32KB 程序 FRAM、512B 信息 FRAM、6KB RAM
封装选项
48 引脚:LQFP (PT)
40 引脚:VQFN (RHA)
32 引脚:VQFN (RHB)