ZHCSMJ1
October 2021
LM61430-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Characteristics
7.7
Systems Characteristics
7.8
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
EN/SYNC Uses for Enable and VIN UVLO
8.3.2
EN/SYNC Pin Uses for Synchronization
8.3.3
Clock Locking
8.3.4
Adjustable Switching Frequency
8.3.5
PGOOD Output Operation
8.3.6
Internal LDO, VCC UVLO, and BIAS Input
8.3.7
Bootstrap Voltage and VCBOOT-UVLO (CBOOT Pin)
8.3.8
Adjustable SW Node Slew Rate
8.3.9
Spread Spectrum
8.3.10
Soft Start and Recovery From Dropout
8.3.11
Output Voltage Setting
8.3.12
Overcurrent and Short Circuit Protection
8.3.13
Thermal Shutdown
8.3.14
Input Supply Current
8.4
Device Functional Modes
8.4.1
Shutdown Mode
8.4.2
Standby Mode
8.4.3
Active Mode
8.4.3.1
Auto Mode - Light-Load Operation
8.4.3.1.1
Diode Emulation
8.4.3.1.2
Frequency Reduction
8.4.3.2
FPWM Mode - Light-Load Operation
8.4.3.2.1
CCM Mode
8.4.3.3
Minimum On Time (High Input Voltage) Operation
8.4.3.4
Dropout
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Choosing the Switching Frequency
9.2.2.2
Setting the Output Voltage
9.2.2.3
Inductor Selection
9.2.2.4
Output Capacitor Selection
9.2.2.5
Input Capacitor Selection
9.2.2.6
BOOT Capacitor
9.2.2.7
BOOT Resistor
9.2.2.8
VCC
9.2.2.9
BIAS
9.2.2.10
CFF and RFF Selection
9.2.2.11
External UVLO
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.1.1
Ground and Thermal Considerations
11.2
Layout Example
12
Device and Documentation Support
12.1
Device Support
12.1.1
第三方产品免责声明
12.2
Documentation Support
12.2.1
Related Documentation
12.3
接收文档更新通知
12.4
支持资源
12.5
Trademarks
12.6
Electrostatic Discharge Caution
12.7
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RJR|14
MPQF507D
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsmj1_oa
1
特性
符合面向汽车应用的 AEC-Q100 标准
温度等级 1:–40°C 至 +150°C,T
J
提供功能安全
可帮助进行功能安全系统设计的文档
针对超低 EMI 要求进行了优化
HotRod™
封装可更大限度地减少开关节点振铃
并行输入路径可更大限度减少寄生电感
可调节 SW 节点上升时间
专为汽车应用而设计
支持 42V 的汽车负载突降
±1% 的总输出稳压精度
V
OUT
可在 1V 至 95% 的 V
IN
范围内调节
可在所有负载下进行高效电源转换
在 13.5V
IN
、3.3V
OUT
下具有 7µA 的无开关电流
具有用于提升效率的外部偏置选项
适用于可扩展电源
与以下器件引脚兼容:
LM61435-Q1
(36V、3.5A、可调节 f
sw
)
LM61440-Q1
(36V、4A、可调节 f
SW
)
LM61460-Q1
(36V、6A、可调节 f
SW
)