ZHCSOF3G
April 2006 – July 2021
TLV320AIC3106
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
说明(续)
6
Device Comparison Table
7
Pin Configuration and Functions
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Thermal Information
8.5
Electrical Characteristics
8.6
Timing Requirements: Audio Data Serial Interface (1)
8.7
Timing Diagrams
8.8
Typical Characteristics
9
Parameter Measurement Information
10
Detailed Description
10.1
Overview
10.2
Functional Block Diagram
10.3
Feature Description
10.3.1
Hardware Reset
10.3.2
Digital Audio Data Serial Interface
10.3.2.1
Right-Justified Mode
10.3.2.2
Left-Justified Mode
10.3.2.3
I2S Mode
10.3.2.4
DSP Mode
10.3.2.5
TDM Data Transfer
10.3.3
Audio Data Converters
10.3.3.1
Audio Clock Generation
10.3.3.2
Stereo Audio ADC
10.3.3.2.1
Stereo Audio ADC High-Pass Filter
10.3.3.2.2
Automatic Gain Control (AGC)
10.3.3.2.2.1
Target Level
10.3.3.2.2.2
Attack Time
10.3.3.2.2.3
Decay Time
10.3.3.2.2.4
Noise Gate Threshold
10.3.3.2.2.5
Maximum PGA Gain Applicable
10.3.3.3
Stereo Audio DAC
10.3.3.3.1
Digital Audio Processing for Playback
10.3.3.3.2
Digital Interpolation Filter
10.3.3.3.3
Delta-Sigma Audio DAC
10.3.3.3.4
Audio DAC Digital Volume Control
10.3.3.3.5
Increasing DAC Dynamic Range
10.3.3.3.6
Analog Output Common-Mode Adjustment
10.3.3.3.7
Audio DAC Power Control
10.3.4
Audio Analog Inputs
10.3.5
Analog Fully Differential Line Output Drivers
10.3.6
Analog High Power Output Drivers
10.3.7
Input Impedance and VCM Control
10.3.8
General-Purpose I/O
10.3.9
Digital Microphone Connectivity
10.3.10
Micbias Generation
10.3.11
Short Circuit Output Protection
10.3.12
Jack/Headset Detection
10.4
Device Functional Modes
10.4.1
Bypass Path Mode
10.4.1.1
Analog Input Bypass Path Functionality
10.4.1.2
ADC PGA Signal Bypass Path Functionality
10.4.1.3
Passive Analog Bypass During Powerdown
10.4.2
Digital Audio Processing for Record Path
10.5
Programming
10.5.1
Digital Control Serial Interface
10.5.1.1
SPI Control Mode
10.5.1.1.1
SPI Communication Protocol
10.5.1.1.2
Limitation on Register Writing
10.5.1.1.3
Continuous Read / Write Operation
10.5.1.2
I2C Control Interface
10.5.1.2.1
I2C BUS Debug in a Glitched System
10.6
Register Maps
10.6.1
Output Stage Volume Controls
11
Application and Implementation
11.1
Application Information
11.2
Typical Application
11.2.1
Design Requirements
11.2.2
Detailed Design Procedure
11.2.3
Application Curves
12
Power Supply Recommendations
13
Layout
13.1
Layout Guidelines
13.2
Layout Examples
14
Device and Documentation Support
14.1
接收文档更新通知
14.2
支持资源
14.3
Trademarks
14.4
Electrostatic Discharge Caution
14.5
术语表
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
RGZ|48
ZXH|80
散热焊盘机械数据 (封装 | 引脚)
RGZ|48
QFND031W
订购信息
zhcsof3g_oa
zhcsof3g_pm
1
特性
立体声音频 DAC:
102dBA 信噪比
16、20、24、32 位数据
支持 8kHz 至 96kHz 的速率
3D、低音、高音、EQ、去加重效果
提供灵活的节能模式和性能
立体声音频 ADC:
92dBA 信噪比
支持 8kHz 至 96kHz 的速率
在录音期间提供数字信号处理和噪声滤除功能
十个音频输入引脚:
在单端或者全差分配置中可编程
适用于浮点输入配置的三态功能
七个音频输出驱动器:
立体声全差动或单端耳机驱动器
全差动立体声线路输出
全差动单声道输出
低功耗:3.3V 模拟电源电压、15mW 立体声、48kHz 回放
具有无源模拟旁路的超低功耗模式
可编程输入/输出模拟增益
用于录音的自动增益控制 (AGC)
可编程麦克风偏置电平
用于灵活时钟生成的可编程 PLL
控制总线可选择 SPI 或 I
2
C
音频串行数据总线支持 I
2
S、左平衡和右平衡、DSP 和 TDM 模式
备选串行 PCM、I
2
S 数据总线,可轻松连接至
Bluetooth™
模块
对数字麦克风和模拟麦克风提供并发支持
广泛的模块化电源控制
电源:
模拟:2.7 V 至 3.6V
数字内核:1.65V–1.95V
数字 I/O:1.1 V 至 3.6V
封装:5.00mm × 5.00mm 80 引脚 VFBGA;
7.00mm × 7.00mm 48 引脚 VQFN