ZHCSG52B
March 2017 – May 2018
TPS543C20
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
简化原理图
4
修订历史记录
5
Device Comparison Table
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.4
Device Functional Modes
8.4.1
Soft-Start Operation
8.4.2
Input and VDD Undervoltage Lockout (UVLO) Protection
8.4.3
Power Good and Enable
8.4.4
Voltage Reference
8.4.5
Prebiased Output Start-up
8.4.6
Internal Ramp Generator
8.4.6.1
Ramp Selections
8.4.7
Switching Frequency
8.4.8
Clock Sync Point Selection
8.4.9
Synchronization and Stackable Configuration
8.4.10
Dual-Phase Stackable Configurations
8.4.10.1
Configuration 1: Master Sync Out Clock-to-Slave
8.4.10.2
Configuration 2: Master and Slave Sync to External System Clock
8.4.11
Operation Mode
8.4.12
API/BODY Brake
8.4.13
Sense and Overcurrent Protection
8.4.13.1
Low-Side MOSFET Overcurrent Protection
8.4.13.2
High-Side MOSFET Overcurrent Protection
8.4.14
Output Overvoltage and Undervoltage Protection
8.4.15
Overtemperature Protection
8.4.16
RSP/RSN Remote Sense Function
8.4.17
Current Sharing
8.4.18
Loss of Synchronization
9
Application and Implementation
9.1
Application Information
9.2
Typical Application: TPS543C20 Stand-alone Device
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Custom Design With WEBENCH® Tools
9.2.2.2
Switching Frequency Selection
9.2.2.3
Inductor Selection
9.2.2.4
Input Capacitor Selection
9.2.2.5
Bootstrap Capacitor Selection
9.2.2.6
BP Pin
9.2.2.7
R-C Snubber and VIN Pin High-Frequency Bypass
9.2.2.8
Output Capacitor Selection
9.2.2.8.1
Response to a Load Transient
9.2.2.8.2
Ramp Selection Design to Ensure Stability
9.2.3
Application Curves
9.3
System Example
9.3.1
Two-Phase Stackable
9.3.1.1
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
11.3
Package Size, Efficiency and Thermal Performance
12
器件和文档支持
12.1
器件支持
12.1.1
开发支持
12.1.1.1
使用 WEBENCH® 工具创建定制设计
12.1.2
文档支持
12.1.2.1
相关文档
12.2
接收文档更新通知
12.3
社区资源
12.4
商标
12.5
静电放电警告
12.6
术语表
13
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
RVF|40
MPQF268C
散热焊盘机械数据 (封装 | 引脚)
RVF|40
QFND333E
订购信息
zhcsg52b_oa
zhcsg52b_pm
1
特性
内部补偿高级电流模式控制
40
A POL
输入电压范围:4V 至
14
V
输出电压范围:0.6V 至 5.5V
集成
3/0.9mΩ
堆叠式 NexFET™功率级,带有无损低侧电流检测功能
固定频率 - 同步到外部时钟和/或同步输出
可通过引脚搭接进行编程的开关频率
独立模式下为 300
kHz 至 2MHz
堆叠模式下为 300kHz 至 1MHz
通过双倍堆叠实现高达
80
A 负载,并具有电流共享、电压共享和 CLK 同步功能
可通过引脚搭接进行编程的基准电压介于 0.6V 至 1.1V 之间,精度达 0.5%
差分遥感
安全启动至预偏置输出电压
高精度打嗝电流限制
异步脉冲注入 (API) 和体制动
40 引脚 5mm × 7mm LQFN 封装,具有 0.5mm 间距和单个散热垫
使用 TPS543C20 并借助
WEBENCH® 电源设计器
创建定制设计方案