ZHCSKE6C
July 2019 – February 2020
TPS63810
,
TPS63811
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
简化原理图
效率与输出电流间的关系
4
修订历史记录
5
器件比较表
6
Pin Configuration and Functions
BGA Package (YFF) Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements
7.7
Switching Characteristics
7.8
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Control Scheme
8.3.1.1
Buck Operation
8.3.1.2
Boost Operation
8.3.1.3
Buck-Boost Operation
8.3.2
Control Scheme
8.3.3
Power-Save Mode Operation (PSM)
8.3.4
Forced-PWM Operation (FPWM)
8.3.5
Ramp-PWM Operation (RPWM)
8.3.6
Device Enable (EN)
8.3.7
Undervoltage Lockout (UVLO)
8.3.8
Soft Start
8.3.9
Output Voltage Control
8.3.9.1
Dynamic Voltage Scaling
8.3.10
Protection Functions
8.3.10.1
Input Voltage Protection (IVP)
8.3.10.2
Current Limit Mode and Overcurrent Protection
8.3.10.3
Thermal Shutdown
8.3.11
Power Good
8.3.12
Load Disconnect
8.3.13
Output Discharge
8.4
Device Functional Modes
8.5
Programming
8.5.1
Serial Interface Description
8.5.2
Standard-, Fast-, and Fast-Mode Plus Protocol
8.5.3
I2C Update Sequence
8.6
Register Map
8.6.1
Register Description
8.6.1.1
Register Map
8.6.1.2
Register CONTROL (Slave address: 0b1110101; Register address: 0x01; Default: 0x00 or 0x20)
Table 3.
Register CONTROL Field Descriptions
8.6.1.3
Register STATUS (Slave address: 0b1110101; Register address: 0x02; Default: 0x00)
Table 4.
Register STATUS Field Descriptions
8.6.1.4
Register DEVID (Slave address: 0b1110101; Register address: 0x03; Default: 0x04)
Table 5.
Register DEVID Field Descriptions
8.6.1.5
Register VOUT1 (Slave address: 0b1110101; Register address: 0x04; Default: 0x3C)
Table 6.
Register VOUT1 Field Descriptions
8.6.1.6
Register VOUT2 (Slave address: 0b1110101; Register address: 0x05; Default: 0x42)
Table 7.
Register VOUT2 Field Descriptions
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
1.8-V to 5.2-V Output Smartphone Power Supply
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.2.1
Input Capacitor Selection
9.2.1.2.2
Inductor Selection
9.2.1.2.3
Output Capacitor Selection
9.2.1.2.4
I2C Pullup Resistor Selection
9.2.1.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
器件和文档支持
12.1
器件支持
12.1.1
第三方产品免责声明
12.2
文档支持
12.2.1
相关文档
12.3
相关链接
12.4
接收文档更新通知
12.5
支持资源
12.6
商标
12.7
术语表
13
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
YFF|15
MXBG163C
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcske6c_oa
zhcske6c_pm
1
特性
输入电压范围:2.2V 至 5.5V
输出电压范围:1.8V 至 5.2V
运行和关断期间,I
2
C 可配置
VSEL 引脚用于在两个输出电压预设之间切换
输出电流
当 V
I
≥ 2.5V、V
O
= 3.3V 时可达 2.5A
当 V
I
≥ 2.8V、V
O
= 3.5V 时可达 2.5A
在整个负载范围内具有高效率
13μA 低工作静态电流
自动节电模式和强制 PWM 模式(I
2
C 可配置)
峰值电流降压/升压模式架构
可在降压、降压/升压和升压操作模式之间定义转换
正向和反向电流运行
启动至预偏置输出
安全、可靠运行 特性
集成软启动
过热和过压保护
关断期间的真正负载断开
正向和反向电流限制
两个器件选项
TPS63810:预编程输出电压(3.3V、3.45V)
TPS63811:启动前的程序输出电压
解决方案尺寸小于 20 mm
2
,仅有四个外部器件