LP5569 エンジン制御およびチャージ・ポンプ搭載の9チャネルI2C、RGB LEDドライバ
- JAJSDI4A July 2017 – September 2017 LP5569
  
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LP5569 エンジン制御およびチャージ・ポンプ搭載の9チャネルI2C、RGB LEDドライバ

このリソースの元の言語は英語です。翻訳は概要を便宜的に提供するもので、自動化ツール (機械翻訳) を使用していることがあり、TI では翻訳の正確性および妥当性につきましては一切保証いたしません。実際の設計などの前には、ti.com で必ず最新の英語版をご参照くださいますようお願いいたします。

1 特長

電源電圧範囲: 2.5V～5.5V
9つの高精度電流シンク
- チャネルごとに最大25.5mA
- 8ビットの個別の電流制御
- 12ビット、20kHzの内部的な個別のPWM制御、オーディオ・ノイズなし
3つのプログラム可能なLEDエンジン
- アクティブなマイクロコントローラ制御なしの独立した照明制御
- 複数のデバイス間の同期
- SRAMメモリに、最大256命令まで、照明パターンのシーケンスを格納可能
- LP5523およびLP55231デバイス互換のコマンド・セット
柔軟な調光制御
- I²C調光制御
- PWM直接入力調光
- PWM入力周波数: 100Hz～20kHz
アダプティブ高効率チャージ・ポンプ制御により、低いバッテリ電圧で高いV_FのLEDを駆動
マスタ・フェーダ制御により、1つのレジスタに書き込むだけで複数のLEDを調光でき、I²Cバスのトラフィックが低減
LEDが非アクティブのとき、2µAの低スタンバイ電流、自動パワーセーブ・モードでは10µA
POR、UVLO、TSD保護

2 アプリケーション

次のような機器のLED照明、インジケータ・ライト、および装飾用ライト

スマート・スピーカー
スマート家電
ドアベル
電気ロック
煙感知器
サーモスタット
セットトップ・ボックス
スマート・ルータ
Bluetooth®ヘッドセット
携帯電話

3 概要

LP5569デバイスはプログラム可能で使いやすい9チャネルのI²C LEDドライバで、各種のアプリケーションで照明効果を生み出すよう設計されています。LEDドライバには、ユーザーによりプログラムされたシーケンスを格納するSRAMメモリと、3つのプログラム可能なLEDエンジンが搭載されており、プロセッサの制御なしで動作可能です。自律的な動作により、プロセッサがスリープ・モードのときシステムの消費電力が削減されます。

高効率のチャージ・ポンプにより、2.5Vの入力電圧でも高いV_FのLEDを駆動できます。LP5569 LEDドライバは、LEDの順方向電圧要件に基づいて最良のチャージ・ポンプのゲインを自律的に選択し、広い動作電圧範囲にわたって良好な効率を維持します。

LEDがアクティブでないとき、LP5569はパワーセーブ・モードへ移行し、アイドル消費電流を大幅に削減します。柔軟なデジタル・インターフェイスにより、同じシステム内で各デバイスに固有のI²Cスレーブ・アドレスを使用して、最大8つのLP5569デバイスを接続でき、すべてのデバイス間で照明効果を同期できます。

製品情報⁽¹⁾

型番	パッケージ	本体サイズ(公称)
LP5569	WQFN (24)	4.00mm×4.00mm

提供されているすべてのパッケージについては、巻末の注文情報を参照してください。

概略回路図

4 改訂履歴

Changes from * Revision (July 2017) to A Revision

Added typical curvesGo

5 Device Comparison Table

PART NUMBER		GROUP		I²C SLAVE ADDRESS
LP5569		0		32h–35h and 40h (see I2C Slave Addressing)
LP5569A		1		42h–45h and 40h (see I2C Slave Addressing)

6 Pin Configuration and Functions

RTW Package

24-Pin WQFN With Exposed Thermal Pad

Top View

Pin Functions

PIN		TYPE⁽¹⁾	DESCRIPTION
NAME	NO.	TYPE⁽¹⁾	DESCRIPTION
ADDR	20	I	I²C slave-address selection pin. See I2C Slave Addressing for more details. This pin must not be left floating.
AGND	4	G	Analog and digital ground. Connect to PGND, exposed thermal pad, and common ground plane.
C1–	24	A	Negative pin of charge-pump flying capacitor 1. If charge pump is not used, this pin must be left floating.
C1+	2	A	Positive pin of charge-pump flying capacitor 1. If charge pump is not used, this pin must be left floating.
C2–	23	A	Negative pin of charge-pump flying capacitor 2. If charge pump is not used, this pin must be left floating.
C2+	1	A	Positive pin of charge-pump flying capacitor 2. If charge pump is not used, this pin must be left floating.
CLK	6	I, OD	Clock input/output. By default this pin is a clock input. If not used, this pin must be connected to GND or VIN.
EN/PWM	5	I	Chip enable and PWM input pin.
GPIO/TRIG/INT	7	I, OD	General-purpose input or open-drain output, or trigger input or open-drain output, or interrupt open-drain output. This pin function is configured in the I²C registers. By default this pin is a general-purpose output (open-drain) and can be left floating if not used.
LED0	19	A	LED current sink 0. If not used, this pin can be left floating.
LED1	18	A	LED current sink 1. If not used, this pin can be left floating.
LED2	17	A	LED current sink 2. If not used, this pin can be left floating.
LED3	16	A	LED current sink 3. If not used, this pin can be left floating.
LED4	15	A	LED current sink 4. If not used, this pin can be left floating.
LED5	14	A	LED current sink 5. If not used, this pin can be left floating.
LED6	13	A	LED current sink 6. If not used, this pin can be left floating.
LED7	12	A	LED current sink 7. If not used, this pin can be left floating.
LED8	11	A	LED current sink 8. If not used, this pin can be left floating.
PGND	21	G	Charge-pump power ground. Connect to AGND, exposed thermal pad, and common ground plane.
SCL	9	I	I²C bus clock line. If not used, this pin must be connected to GND or VIN.
SDA	8	I, OD	I²C bus data line. If not used, this pin must be connected to GND or VIN.
V1P8	10	P	Input power for digital circuitry.
VIN	3	P	Input power, a 1-µF capacitor must be connected between PGND and this pin.
VOUT	22	A	Charge-pump output voltage. If charge pump is used, a 1-µF capacitor must be connected between PGND and this pin. If charge pump is not used or is used in 1× mode only, the capacitor can be omitted.
Exposed thermal pad	—	—	Must be connected to AGND (pin 4), PGND (pin 21), and common ground plane. See Layout Example. Must be soldered to achieve appropriate power dissipation and mechanical reliability.

(1) A: analog pin; G: ground pin; P: power pin; I: input pin; OD: open-drain output pin

7 Specifications

7.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)⁽¹⁾

	MIN	MAX	UNIT
Voltage on VIN, CLK, ADDR, EN/PWM, GPIO/TRIG/INT, SCL, SDA, VOUT⁽²⁾	–0.3	6	V
Voltage on LED0 to LED8, C1–, C2–, C1+, C2+	−0.3	V_VIN + 0.3 V with 6 V max.	V
Voltage on V1P8	−0.3	2	V
Continuous power dissipation	Internally limited	Internally limited
Junction temperature, T_J-MAX	–40	125	°C
Storage temperature, T_stg	−65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) VOUT cannot be forced to a power supply during device shutdown.

7.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2500	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±250	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

	MIN	MAX	UNIT
Input voltage on VIN	2.5	5.5	V
Voltage on LED0 to LED8, C1–, C2–, C1+, C2+, VOUT	0	V_VIN	V
Voltage on CLK, ADDR, EN/PWM, GPIO/TRIG/INT, SDA, SCL	0	V_VIN	V
Input voltage on V1P8	1.65	1.95	V
Output current on VOUT	0	160	mA
Operating ambient temperature, T_A ⁽¹⁾	−40	85	°C

(1) In applications where high power dissipation and/or poor PCB cooling status is present, the maximum ambient temperature might require derating. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP= 125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the device in the application (R_θJA), as given by the equation: T_A-MAX = T_J-MAX-OP – (R_θJA × P_D-MAX).

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		LP5569	UNIT
		RTW (WQFN)
		24 PINS
R_θJA	Junction-to-ambient thermal resistance	35.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	26.7	°C/W
R_θJB	Junction-to-board thermal resistance	13.1	°C/W
ψ_JT	Junction-to-top characterization parameter	0.4	°C/W
ψ_JB	Junction-to-board characterization parameter	13.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	4.6	°C/W

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

7.5 Electrical Characteristics

Unless otherwise noted, specifications apply to the LP5569 device in a circuit per the typical application diagram for the single device with V_VIN = 3.6 V, V1P8 = 1.8 V, V_EN/PWM = V_VIN, C_IN = C_OUT= C_FLY1 = C_FLY2 = 1 µF. Typical (TYP) values apply for T_A = 25°C and minimum (MIN) and maximum (MAX) apply over the operating ambient temperature range (−40°C < T_A < 85°C).

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
I_VIN	Standby supply current	V_EN/PWM = 0 V, chip_en (bit) = 0		0.2	1	µA
		V_EN/PWM = 3.3 V, chip_en (bit) = 0, external CLK not running		1	2
		V_EN/PWM = 3.3 V, chip_en (bit) = 0, external CLK running		2	4
	Normal-mode supply current	External CLK running, charge pump and current sinks disabled		56	70	µA
		Charge pump in 1× mode, no load, current sinks disabled		65	90	µA
		Charge pump in 1.5× mode, no load, current-sink outputs disabled		1.8		mA
	Power-save mode supply current	External CLK running, see Automatic Power-Save Mode		10	15	µA
	Power-save mode supply current	Internal oscillator running		10	15	µA
I_V1P8	Standby supply current	V_EN/PWM = 0 V, chip_en(bit) = 0		0.2	1	µA
		V_EN/PWM = 3.3 V, chip_en (bit) = 0, external CLK not running		0.2	2	µA
		V_EN/PWM = 3.3 V, chip_en (bit) = 0, external CLK running		1	4	µA
	Normal-mode supply current	External CLK running, charge pump and current sinks disabled		174	190	µA
		Charge pump in 1× mode, no load, current sinks disabled		174	190	µA
		Charge pump in 1.5× mode, no load, current-sink- outputs disabled		180		µA
	Powersave-mode supply current	External CLK running		1	5	µA
	Powersave-mode supply current	Internal oscillator running		1	5	µA
ƒ_OSC	32-kHz internal oscillator frequency accuracy	T_A = 25°C	–10%		10%
ƒ_OSC	10-MHz internal oscillator frequency accuracy		–7%		7%
V_UVLO	Undervoltage lockout	V_VIN falling		2.2		V
V_UVLO	Undervoltage lockout	V_VIN rising		2.3		V

7.6 Charge-Pump Electrical Characteristics

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
R_OUT	Charge-pump output resistance	Gain = 1×, V_VIN= 4.2 V		1		Ω
R_OUT	Charge-pump output resistance	Gain = 1.5×, V_VIN = 3.7 V		3.5		Ω
V_OUT		V_VIN = 3.7 V, I_OUT = 160 mA, gain = 1.5×	4.41	4.5	4.59	V
ƒ_SW	Switching frequency			1.25		MHz
I_CL	Output current limit	V_OUT = 0 V, V_VIN = 3.7 V, CP_CONFIG = 0xFF		600		mA
t_ON	V_OUT turnon time	I_OUT = 0 mA, V_IN ≥ 3 V, V_OUT > 4.1 V, gain = 1.5×		100		µs
I_OUT	Maximum output current	V_VIN > 3.1 V, V_OUT dropped 10%, gain = 1.5×		200		mA
I_OUT	Maximum output current	V_IN > 2.5 V, V_OUT dropped 10%, gain = 1.5×		150		mA

7.7 LED Current Sinks Electrical Characteristics

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
I_LEAKAGE	Leakage current (LED0 to LED8)	PWM = 0%, V_LED = 5 V			1	µA
I_MAX	Maximum sink current		24.5	25.5	26.5	mA
I_{LED_ACC}	Sink current accuracy⁽¹⁾	Current set to 17.5 mA. PWM = 100%	–4.5%		4.5%
I_{LED_MATCH}	Matching⁽¹⁾	Current set to 17.5 mA		1%	2.5%
ƒ_LED	LED switching frequency			19.5		kHz
V_SAT	Saturation voltage⁽²⁾	Output current set to 25.5 mA		90	110	mV

(1) Output-current accuracy is the difference between the actual value of the output current and the programmed value of this current. Matching is the maximum difference from the average. For the constant-current outputs on the device (LED0 to LED8), the following are determined: the maximum output current (MAX), the minimum output current (MIN), and the average output current of all outputs (AVG). The matching number is calculated: (MAX – MIN) / AVG. The typical specification provided is the most likely norm of the matching figure for all devices. Note that some manufacturers have different definitions in use.

(2) Saturation voltage is defined as the voltage when the LED current has dropped 10% from the value measured at 1 V.

7.8 Logic Interface Characteristics

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
LOGIC INPUT (EN/PWM, SCL, ADDR)
V_IL	Input low level				0.4	V
V_IH	Input high level		1.25			V
I_lkg	Input leakage current	V_I ≤ V_VIN	–1		1	µA
LOGIC OUTPUT (SDA, GPIO/TRIG/INT, CLK)
V_IL	Input low level	Pin configured as input			0.4	V
V_IH	Input high level	Pin configured as input	1.25			V
I_lkg	Input leakage current	Pin configured as input, V_VIN = 5.5 V, V_I≤ V_VIN	–1		1	µA
V_OL	Output low level	I_PULLUP = 3 mA		0.2	0.5	V
I_L	Output leakage current	Pin configured as output, Hi-Z state			1	µA

7.9 Timing Requirements (EN/PWM)

		TYP	MAX	UNIT
t_EN	Enable time, EN/PWM first rising edge until first I²C access	2	3	ms
t_{EN_TIMEOUT}	EN timeout, EN/PWM = low time while in standby mode (enable function)	15		ms
t_{PWM_TIMEOUT}	PWM timeout, EN/PWM = low time while in normal mode (PWM function)	15		ms
PWM_res	Resolution for EN/PWM input when configured as PWM, f_PWM=10 kHz	10		bits

7.10 Serial-Bus Timing Requirements (SDA, SCL), See Figure 1

I²C fast mode

		MIN	MAX	UNIT
ƒ_SCL	Clock frequency	0	400	kHz
1	Hold time (repeated) START condition	0.6		µs
2	Clock low time	1.3		µs
3	Clock high time	600		ns
4	Setup time for a repeated START condition	600		ns
5	Data hold time	0		ns
6	Data setup time	100		ns
7	Rise time of SDA and SCL	20 + 0.1Cb	300	ns
8	Fall time of SDA and SCL	15 + 0.1Cb	300	ns
9	Setup time for STOP condition	600		ns
10	Bus-free time between a STOP and a START condition	1.3		µs
Cb	Capacitive load for each bus line	10	200	pF

7.11 External Clock Timing Requirements (CLK), See Figure 2

over operating ambient temperature range (unless otherwise noted)

		MIN	TYP	MAX	UNIT
ƒ_CLK	Clock frequency		32.7		kHz
t_CLKH	High time	6			µs
t_CLKL	Low time	6			µs
t_r	Clock rise time, 10% rising edge to 90% rising edge			2	µs
t_f	Clock fall time, 90% falling edge to 10% falling edge			2	µs

Figure 1. Timing Parameters

Figure 2. External Clock Signal

7.12 Typical Characteristics

Unless otherwise specified: V_VIN = 3.6 V, C_IN = C_OUT = 1 μF, C1 = C2 = 1 μF, T_A = 25°C. C_IN, C_OUT, C1, C2: Low-ESR surface-mount ceramic capacitors (MLCCs) used in setting electrical characteristics.

Figure 3. Charge Pump 1.5× Efficiency vs Load Current

LP5569 Charge_Pump_0x08_VIN_3.6v_Temperature_25C.gif

Figure 5. Charge Pump (1×) Start-Up Waveform

LP5569 Charge_Pump_0x18_VIN_3.6v_Temperature_25C.gif

Figure 7. Charge Pump (Auto) Start-Up Waveform

Figure 9. Serial Bus Write and Charge Pump Start-Up Waveform

I_LEDx setting per channel = 17.5 mA

Figure 11. LED Current Accuracy Distribution

Figure 4. Output Voltage of the Charge Pump (1.5×) as a Function of Load Current at Six Input Voltage Levels

LP5569 Charge_Pump_0x10_VIN_3.6v_Temperature_25C.gif

Figure 6. Charge Pump (1.5×) Start-Up Waveform

Figure 8. Supply Current in Power-Save Mode vs V_VIN

I_LEDx setting per channel = 17.5 mA

Figure 10. LED Current Matching Distribution