SBOS876B September   2017  – February 2020 TMP461-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Simplified Block Diagram
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
        1. 7.3.1.1 Standard Binary to Decimal Temperature Data Calculation Example
        2. 7.3.1.2 Standard Decimal to Binary Temperature Data Calculation Example
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Filtering
      5. 7.3.5 Sensor Fault
      6. 7.3.6 ALERT and THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 General-Call Reset
    6. 7.6 Register Map
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Local and Remote Temperature Registers
        3. 7.6.1.3  Status Register
        4. 7.6.1.4  Configuration Register
        5. 7.6.1.5  Conversion Rate Register
        6. 7.6.1.6  One-Shot Start Register
        7. 7.6.1.7  Channel Enable Register
        8. 7.6.1.8  Consecutive ALERT Register
        9. 7.6.1.9  η-Factor Correction Register
        10. 7.6.1.10 Remote Temperature Offset Register
        11. 7.6.1.11 Manufacturer Identification Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Radiation Environments
      1. 8.3.1 Single Event Latch-Up
      2. 8.3.2 Single Event Functional Interrupt
      3. 8.3.3 Single Event Upset
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

1 Features

  • QMLV Qualified: 5962R-1721801VXC
    • Thermally Enhanced HKU Package
    • Radiation-Hardness-Assured (RHA) up to Total Ionizing Dose (TID) 100 krad(Si) at low dose rate (LDR) of 10 mrad/s
    • Single Event Latchup (SEL) Immune to 76 MeV·cm2/mg at 125°C
    • 10-Lead HKU Ceramic Package
  • Remote Diode Temperature Sensor Accuracy: ±1.5°C (Across Extended Temperature Range of [–55°C to 125°C])
  • Local Temperature Sensor Accuracy: ±2°C (Across Extended Temperature Range of [–55°C to 125°C])
  • Enables Measurement Of Remote Diode Temperatures in the Range of –64°C to 191°C
  • Resolution for Local and Remote Channels: 0.0625°C
  • Supply and Logic Voltage Range: 1.7 V to 3.6 V
  • 35-µA Operating Current (1 SPS),
    3-µA Shutdown Current
  • Series Resistance Cancellation
  • η-Factor and Offset Correction
  • Programmable Digital Filter
  • Diode Fault Detection
  • Two-Wire and SMBus™ Serial Interface Compatible with Pin-Programmable Address