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  • LMH5401 8-GHz, Low-Noise, Low-Power, Fully-Differential Amplifier

    • SBOS710D October   2014  – February 2018 LMH5401

      PRODUCTION DATA.  

  • CONTENTS
  • SEARCH
  • LMH5401 8-GHz, Low-Noise, Low-Power, Fully-Differential Amplifier
  1. 1 Features
  2. 2 Applications
    1.     Distortion versus Frequency (G = 12 dB, SE-DE, RL = 200 Ω, VPP = 2 V)
  3. 3 Description
    1.     LMH5401 Driving an ADC12J4000
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = 5 V
    6. 6.6 Electrical Characteristics: VS = 3.3 V
    7. 6.7 Typical Characteristics: 5 V
    8. 6.8 Typical Characteristics: 3.3 V
    9. 6.9 Typical Characteristics: 3.3-V to 5-V Supply Range
  7. 7 Parameter Measurement Information
    1. 7.1  Output Reference Points
    2. 7.2  ATE Testing and DC Measurements
    3. 7.3  Frequency Response
    4. 7.4  S-Parameters
    5. 7.5  Frequency Response with Capacitive Load
    6. 7.6  Distortion
    7. 7.7  Noise Figure
    8. 7.8  Pulse Response, Slew Rate, and Overdrive Recovery
    9. 7.9  Power Down
    10. 7.10 VCM Frequency Response
    11. 7.11 Test Schematics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully-Differential Amplifier
        1. 8.3.1.1 Power Down and Ground Pins
      2. 8.3.2 Operations for Single-Ended to Differential Signals
        1. 8.3.2.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversion
        2. 8.3.2.2 DC-Coupled Input Signal Path Considerations for SE-DE Conversions
        3. 8.3.2.3 Resistor Design Equations for Single-to-Differential Applications
        4. 8.3.2.4 Input Impedance Calculations
      3. 8.3.3 Differential-to-Differential Signals
        1. 8.3.3.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
        2. 8.3.3.2 DC-Coupled, Differential-Input to Differential-Output Design Issues
      4. 8.3.4 Output Common-Mode Voltage
      5. 8.3.5 LMH5401 Comparison
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation With a Split Supply
      2. 8.4.2 Operation With a Single Supply
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Stability
      2. 9.1.2 Input and Output Headroom Considerations
      3. 9.1.3 Noise Analysis
      4. 9.1.4 Noise Figure
      5. 9.1.5 Thermal Considerations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Driving Matched Loads
        2. 9.2.2.2 Driving Unmatched Loads For Lower Loss
        3. 9.2.2.3 Driving Capacitive Loads
        4. 9.2.2.4 Driving ADCs
          1. 9.2.2.4.1 SNR Considerations
          2. 9.2.2.4.2 SFDR Considerations
          3. 9.2.2.4.3 ADC Input Common-Mode Voltage Considerations : AC-Coupled Input
          4. 9.2.2.4.4 ADC Input Common-Mode Voltage Considerations : DC-Coupled Input
        5. 9.2.2.5 GSPS ADC Driver
        6. 9.2.2.6 Common-Mode Voltage Correction
        7. 9.2.2.7 Active Balun
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
      1. 9.3.1 Do:
      2. 9.3.2 Don't:
  10. 10Power Supply Recommendations
    1. 10.1 Supply Voltage
    2. 10.2 Single-Supply
    3. 10.3 Split-Supply
    4. 10.4 Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
  14. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • RMS|14
    • MPQF401
Thermal pad, mechanical data (Package|Pins)
Orderable Information
  • sbos710d_oa
  • sbos710d_pm
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  • Full reading width
    • Full reading width
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    • Expanded reading width
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DATA SHEET

LMH5401 8-GHz, Low-Noise, Low-Power, Fully-Differential Amplifier

1 Features

  • Gain Bandwidth Product (GBP): 8 GHz
  • Excellent Linearity Performance:
    DC to 2 GHz, G = 12 dB
  • Slew Rate: 17,500 V/µs
  • Low HD2, HD3 Distortion
    (1 VPP, 200 Ω, DE-DE, G = 12 dB):
    • 100 MHz: HD2 at –104 dBc, HD3 at –96 dBc
    • 200 MHz: HD2 at –95 dBc, HD3 at –92 dBc
    • 500 MHz: HD2 at –80 dBc, HD3 at –77 dBc
    • 1 GHz: HD2 at –64 dBc, HD3 at –58 dBc
  • Low IMD2, IMD3 Distortion
    (2 VPP, 200 Ω, DE-DE, G = 12 dB):
    • 200 MHz: IMD2 at –96 dBc, IMD3 at –95 dBc
    • 500 MHz: IMD2 at –80 dBc, IMD3 at –83 dBc
    • 1 GHz: IMD2 at –70 dBc, IMD3 at –63 dBc
  • Input Voltage Noise: 1.25 nV/√Hz
  • Input Current Noise: 3.5 pA/√Hz
  • Supports Single- and Dual-Supply Operation
  • Power Consumption: 55 mA
  • Power-Down Feature

2 Applications

  • GSPS ADC Drivers
  • ADC Drivers for High-Speed Data Acquisition
  • ADC Drivers for 1-GBPS Ethernet over Microwave
  • DAC Buffers
  • IF, RF, and Baseband Gain Blocks
  • SAW Filter Buffers and Drivers
  • Balun Replacement DC to 2 GHz
  • Level Shifters

Distortion versus Frequency
(G = 12 dB, SE-DE, RL = 200 Ω, VPP = 2 V)

LMH5401 TC_C014_H23_5V_Freq_SEIn.png

3 Description

The LMH5401 device is a very high-performance, differential amplifier optimized for radio frequency (RF), intermediate frequency (IF), or high-speed, dc-coupled, time-domain applications. The device is ideal for dc- or ac-coupled applications that may require a single-ended-to-differential (SE-DE) conversion when driving an analog-to-digital converter (ADC). The LMH5401 generates very low levels of second- and third-order distortion when operating in SE-DE or differential-to-differential (DE-DE) mode.

The amplifier is optimized for use in both SE-DE and DE-DE systems. The device has unprecedented usable bandwidth from DC to 2 GHz. The LMH5401 can be used for SE-DE conversions in the signal chain without external baluns in a wide range of applications such as test and measurement, broadband communications, and high-speed data acquisition.

A common-mode reference input pin aligns the amplifier output common-mode with the ADC input requirements. Power supplies between 3.3 V and 5 V can be selected and dual-supply operation is supported when required by the application. A power-down feature is also available for power savings.

This level of performance is achieved at a very low power level of 275 mW when a 5-V supply is used. The device is fabricated in Texas Instruments' advanced complementary BiCMOS process and is available in a space-saving, UQFN-14 package for higher performance.

Device Information(1)

DEVICE NAMEPACKAGEBODY SIZE
LMH5401 UQFN (14) 2.50 mm × 2.50 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

LMH5401 Driving an ADC12J4000

LMH5401 alt_sbos710.gif

4 Revision History

Changes from C Revision (October 2017) to D Revision

  • Added table note to Pin Functions table to distinguish pin typesGo
  • Changed GND and PD pin descriptions in Pin Functions tableGo
  • Changed VOUT_AMP value from 2 VPP to 1 VPP in condition statement of HD2 and HD3 curveGo
  • Changed VOUT_AMP value from 2 VPP to 1 VPP in condition statement of HD2 and HD3 Differential curveGo
  • Changed VOUT_AMP value from 2 VPP to 1 VPP in condition statement of HD2 and HD3 vs Output Voltage curveGo
  • Changed VOUT_AMP value from 2 VPP to 1 VPP in condition statement of HD2 and HD3 vs Input Common-Mode Voltage curveGo
  • Changed VOUT_AMP value from 2 VPP to 1 VPP in condition statement of HD2 and HD3 vs Output Common-Mode Voltage curveGo
  • Corrected and deleted note from Functional Block DiagramGo
  • Added Power Down and Ground Pins subsection to Feature Description sectionGo

Changes from B Revision (January 2015) to C Revision

  • Added Input, VIO, IIB, and IIO parameters to 5-V Electrical Characteristics table Go
  • Changed RT and RG2 values in first row of Table 2Go
  • Changed Functional Block Diagram graphicGo
  • Changed Device Comparison Table to be a separate sub-section within Feature Description sectionGo
  • Added Driving Unmatched Loads For Lower Loss sectionGo
  • Changed 8 MHz to 8 GHz in first sentence of Layout Guidelines section Go

Changes from A Revision (October 2014) to B Revision

  • Added dc-coupled to first sentence of Description section Go
  • Changed second sentence of second paragraph in Description sectionGo
  • Updated ESD Ratings table to current standards Go
  • Changed AC Performance, IMD3 and IMD2 parameter test conditions in 5-V Electrical Characteristics table Go
  • Changed Input, VICL parameter maximum specification in 5-V Electrical Characteristics tableGo
  • Changed Input, VICL parameter maximum specification in 3.3-V Electrical Characteristics table Go
  • Changed Output, VOCRH parameter test condition from Output voltage range low to TA = –40°C to 85°C in 3.3-V Electrical Characteristics table Go
  • Changed Typical Characteristics curves: updated color scheme, grammatical edits throughout curves Go
  • Added Large-Signal to title of Figure 2, Figure 4, and Figure 6Go
  • Added Large-Signal to title of Figure 8Go
  • Changed Differential-Ended to Differential in title of Figure 11Go
  • Added Large-Signal to titles of Figure 30, Figure 32, and Figure 34Go
  • Added Large-Signal to title of Figure 36Go
  • Changed correction to reduction in second paragraph of Output Reference Points sectionGo
  • Changed header for last column in Table 1Go
  • ChangedFigure 56 through Figure 59: modifications to figures, added AV = 4 V/V to titlesGo
  • Deleted last sentence from first paragraph of the Fully-Differential Amplifier sectionGo
  • Changed 1.2 V to the specified minimum voltage in the third paragraph of the Fully-Differential Amplifier sectionGo
  • Added sixth sentence stating the feedback path must always be DC-coupled to the AC-Coupled Signal Path Considerations sectionGo
  • Added AV = 4 V/V to title of Figure 62Go
  • Deleted example from the Operation with a Single Supply sectionGo
  • Added Stability section Go
  • Changed 15 dB to 19 dB in third paragraph of SFDR Considerations section Go
  • Added Figure 75 to the Active Balun section Go

Changes from * Revision (October 2014) to A Revision

  • Changed Output Common-Mode Control Pin, VCM voltage range low and high parameter typical specifications in 5-V Electrical CharacteristicsGo
  • Changed Output Common-Mode Control Pin, VCM voltage range low and high parameter specifications in 3.3-V Electrical Characteristics tableGo

5 Pin Configuration and Functions

RMS Package
14-Pin UQFN
Top View
LMH5401 po_sbos710.gif

Pin Functions

PINTYPEDESCRIPTION
NAMENO.
CM 2 I Input pin to set amplifier output common-mode voltage
FB– 7 O Negative output feedback component connection
FB+ 4 O Positive output feedback component connection
GND 11, 14 P Power down ground. See Power Down and Ground Pins
IN– 5 I Negative input pin
IN+ 6 I Positive input pin
OUT– 12 O Negative output pin
OUT+ 13 O Positive output pin
PD 9 I Power-down (logic 1 = power down). See Power Down and Ground Pins
VS– 3, 8 P Negative supply voltage
VS+ 1, 10 P Positive supply voltage

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
Power supply 5.5 V
Input voltage range (VS–) – 0.7 (VS+) + 0.7 V
Input current 10 mA
Output current (sourcing or sinking) OUT+, OUT– 100 mA
Continuous power dissipation See Thermal Information table
Maximum junction temperature, TJ 150 °C
Maximum junction temperature, continuous operation, long-term reliability 125 °C
Operating free-air temperature, TA –40 85 °C
Storage temperature, Tstg –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUEUNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MINNOMMAXUNIT
Supply voltage (VS = VS+ – VS–) 3.15 5 5.25 V
Operating junction temperature, TJ –40 125 °C
Ambient operating air temperature, TA –40 25 85 °C

6.4 Thermal Information

THERMAL METRIC(1)LMH5401UNIT
RMS (UQFN)
14 PINS
RθJA Junction-to-ambient thermal resistance 101 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51 °C/W
RθJB Junction-to-board thermal resistance 61 °C/W
ψJT Junction-to-top characterization parameter 4.2 °C/W
ψJB Junction-to-board characterization parameter 61 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

 
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