SNAS760A April   2018  – January 2022 LMK00334-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Propagation Delay and Output Skew
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Differential Voltage Measurement Terminology
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Crystal Power Dissipation vs. RLIM
      2. 8.3.2 Clock Inputs
      3. 8.3.3 Clock Outputs
        1. 8.3.3.1 Reference Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 VCC and VCCO Power Supplies
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Driving the Clock Inputs
        2. 9.2.1.2 Crystal Interface
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Termination and Use of Clock Drivers
        2. 9.2.2.2 Termination for DC-Coupled Differential Operation
        3. 9.2.2.3 Termination for AC-Coupled Differential Operation
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Current Consumption and Power Dissipation Calculations
      1. 10.1.1 Power Dissipation Example: Worst-Case Dissipation
    2. 10.2 Power Supply Bypassing
      1. 10.2.1 Power Supply Ripple Rejection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Management
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 Qualified for Automotive Applications:
    • Device Temperature Grade 2: –40°C to 105°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C5
    • Device MM ESD Classification Level M2
  • 3:1 Input multiplexer
    • Two universal inputs operate up to 400 MHz and accept LVPECL, LVDS, CML, SSTL, HSTL, HCSL, or single-ended clocks
    • One crystal input accepts a 10- to 40-MHz crystal or single-ended clock
  • Two banks with two differential outputs each
    • HCSL, or Hi-Z (selectable)
    • Additive RMS phase jitter for PCIe Gen3/Gen4 at 100 MHz:
      • 30 fs RMS (typical)
  • High PSRR: –72 dBc at 156.25 MHz
  • LVCMOS output with synchronous enable input
  • Pin-controlled configuration
  • VCC core supply: 3.3 V ± 5%
  • Three independent VCCO output supplies: 3.3 V, 2.5 V ± 5%
  • Industrial temperature range: –40°C to +105°C
  • 32-pin WQFN (5 mm × 5 mm)