特定信息和资源(包括非 TI 网站的链接)可能由 TI 合作伙伴网络成员提供,在此将其列出,仅供您方便查阅之用。TI 不是该类信息和资源等内容的提供方,也不对其负责,在您将其用于预期用途时,应由您自行对其进行认真评估。此处包含该类信息和资源并不意味着 TI 认可这些公司,且无论是单独使用还是与任何 TI 产品或服务结合使用,均不得将其视为对其产品或服务的适用性的保证或陈述。
Tuya Inc.
Tuya Inc. (NYSE: TUYA; HKEX: 2391) is a global leading cloud platform service provider with a mission to build a smart solutions developer ecosystem and enable everything to be smart. Tuya has pioneered a purpose-built cloud developer platform with cloud and generative AI capabilities that delivers a full suite of offerings, including Platform-as-a-Service, or PaaS, Software-as-a-Service, or SaaS, and smart solutions for developers of smart device, commercial applications, and industries. Through its cloud developer platform, Tuya has activated a vibrant global developer community of brands, OEMs, AI Agents, system integrators and independent software vendors to collectively strive for smart solutions ecosystem embodying the principles of green and low-carbon, security, high efficiency, agility, and openness.
As of June 30, 2024, the Tuya Cloud Developer Platform had over 1,192,000 registered developers from more than 200 countries and regions.
- 子卡
- 中国
- 亚洲其他地区
- 北美
- 南美洲
- 印度
- 大洋洲
- 日本
- 欧洲
- 非洲
- Building 1,Huace Center, Xihu District
- Hangzhou, Zhejiang, 310000
- China
资源
TUYA-3P-WIRELESS-MODULES — TUYA BDU Module for CC2340R5 32-bit Arm Cortex-M0+ Bluetooth
Tuya BDU is a low-power embedded Bluetooth module that Tuya has developed. It consists of a highly integrated Bluetooth chip (CC2340R5), a few peripheral circuits, an embedded Bluetooth network communication protocol stack, and rich library functions.
BDU consists of a low-power 32-bit MCU, a (...)