TI 不会为此硬件提供持续且直接的设计支持。要在设计期间获得支持，请联系 Tuya Inc..
TUYA-3P-WIRELESS-MODULES
概述
Tuya BDU is a low-power embedded Bluetooth module that Tuya has developed. It consists of a highly integrated Bluetooth chip (CC2340R5), a few peripheral circuits, an embedded Bluetooth network communication protocol stack, and rich library functions.
BDU consists of a low-power 32-bit MCU, a Bluetooth LE 5.3/2.4G radio-frequency band, 512 KB flash memory, and 36 KB SRAM.
特性
- Embedded with a low-power 32-bit MCU, which can also function as an application processor.
- Clock rate: 48 MHz
- Working voltage: 1.71 to 3.8 V
- Peripherals: 5 PWMs, 2 UART pins, and 2 ADC pins
- Bluetooth LE RF features
- Compatible with the Bluetooth LE 5.3
- The RF data rate can be up to 1 Mbps
- TX power: +8 dBm
- RX sensitivity: -96 dBm@Bluetooth LE 1 Mbps
- Embedded hardware AES encryption
- Onboard PCB antenna with a gain of 1 dBi
- Working temperature: -40°C to +105°C
低功耗 2.4GHz 产品
照片提供方为 Tuya Inc.
支持与培训
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