SN74AUC1G74

ACTIVE

Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset

Product details

Number of channels 1 Technology family AUC Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 275 IOL (max) (mA) 9 IOH (max) (mA) -9 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 1 Technology family AUC Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 275 IOL (max) (mA) 9 IOH (max) (mA) -9 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating Catalog
VSSOP (DCU) 8 6.2 mm² (2 mm × 3.1 mm) DSBGA (YZP) 8 2.8125 mm² (— mm × — mm) UQFN (RSE) 8 2.25 mm² (1.5 mm × 1.5 mm) SSOP (DCT) 8 11.8 mm² (2.95 mm × 4 mm)
  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub-1-V Operable
  • Max tpd of 1.5 ns at 1.8 V
  • Low Power Consumption, 10-µA Max ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree Is a trademark of Texas Instruments

  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub-1-V Operable
  • Max tpd of 1.5 ns at 1.8 V
  • Low Power Consumption, 10-µA Max ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree Is a trademark of Texas Instruments

This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. To better optimize the flip-flop for higher frequencies, the CLR input overrides the PRE input when they are both low.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. To better optimize the flip-flop for higher frequencies, the CLR input overrides the PRE input when they are both low.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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Technical documentation

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Top documentation Type Title Format options Date
* Data sheet SN74AUC1G74 datasheet (Rev. D) Jun 25, 2007
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML Dec 15, 2022

Design & development

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Evaluation board

5-8-LOGIC-EVM — Generic logic evaluation module for 5-pin to 8-pin DCK, DCT, DCU, DRL and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
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Simulation model

HSPICE MODEL OF SN74AUC1G74

SCEJ201.ZIP (94 KB) - HSpice model
Supported products & hardware
Simulation model

SN74AUC1G74 IBIS Model (Rev. A)

SCEM396 (298 KB) - IBIS model
Supported products & hardware
Package Pins CAD symbols, footprints & 3D models
VSSOP (DCU) 8 Ultra Librarian
DSBGA (YZP) 8 Ultra Librarian
UQFN (RSE) 8 Ultra Librarian
SSOP (DCT) 8 Ultra Librarian

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