Home Logic & voltage translation Flip-flops, latches & registers D-type flip-flops
Home
Logic & voltage translation
Flip-flops, latches & registers
D-type flip-flops

SN74LVC1G74

ACTIVE

Single Positive-Edge-Triggered D-Type Flip-Flop With Clear and Preset

Order now
Data sheet

SN74LVC1G74

ACTIVE
Data sheet Order now

Product details

Number of channels 1 Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 200 IOL (max) (mA) 32 IOH (max) (mA) -32 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 125 Rating Catalog
Number of channels 1 Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 200 IOL (max) (mA) 32 IOH (max) (mA) -32 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 125 Rating Catalog
SSOP (DCT) 8 11.8 mm² 2.95 x 4 UQFN (RSE) 8 2.25 mm² 1.5 x 1.5 VSSOP (DCU) 8 6.2 mm² 2 x 3.1 X2SON (DQE) 8 1.4 mm² 1.4 x 1
  • Available in the Texas Instruments NanoFree™ package
  • Supports 5-V VCC operation
  • Inputs accept voltages to 5.5-V
  • Supports down translation to VCC
  • Maximum tpd of 5.9-ns at 3.3-V
  • Low power consumption, 10-µA maximum ICC
  • ±24-mA output drive at 3.3-V
  • Typical VOLP (output ground bounce) < 0.8-V at VCC = 3.3-V, TA = 25°C
  • Typical VOHV (output VOH undershoot) > 2-V at VCC = 3.3 V, TA = 25°C
  • Ioff supports live insertion, partial-power-down mode, and back-drive protection
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 2000-V human-body model
    • 200-V machine model
    • 1000-V charged-device model
  • Available in the Texas Instruments NanoFree™ package
  • Supports 5-V VCC operation
  • Inputs accept voltages to 5.5-V
  • Supports down translation to VCC
  • Maximum tpd of 5.9-ns at 3.3-V
  • Low power consumption, 10-µA maximum ICC
  • ±24-mA output drive at 3.3-V
  • Typical VOLP (output ground bounce) < 0.8-V at VCC = 3.3-V, TA = 25°C
  • Typical VOHV (output VOH undershoot) > 2-V at VCC = 3.3 V, TA = 25°C
  • Ioff supports live insertion, partial-power-down mode, and back-drive protection
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 2000-V human-body model
    • 200-V machine model
    • 1000-V charged-device model

This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

A low level at the preset ( PRE) or clear ( CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

A low level at the preset ( PRE) or clear ( CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
filter Find other D-type flip-flops
Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Drop-in replacement with upgraded functionality to the compared device
SN74AUP1G74 ACTIVE Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop Smaller voltage range (0.8V to 3.6V), longer average propagation delay (8ns), lower average drive strength (4mA)

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 30
Type Title Date
* Data sheet SN74LVC1G74 Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset datasheet (Rev. G) PDF | HTML 14 Sep 2021
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 Dec 2022
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Application brief Simplifying Solid-State Relay Designs With Logic PDF | HTML 08 Jan 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
White paper Solving CMOS Transition Rate Issues Using Schmitt Trigger Solution (Rev. A) 01 May 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic evaluation module for 5-pin to 8-pin DCK, DCT, DCU, DRL and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
User guide: PDF
Not available on TI.com
Simulation model

SN74LVC1G74 IBIS Model

SCEM591.ZIP (52 KB) - IBIS Model
Download
Reference designs

TIDA-010032 — Universal data concentrator reference design supporting Ethernet, 6LoWPAN RF mesh & more

IPv6-based grid communications are becoming the standard choice in industrial markets and applications like smart meters and grid automation. The universal data concentrator design provides a complete IPv6-based network solution integrated with Ethernet backbone communication, 6LoWPAN RF mesh (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-01065 — Isolated Self-Powered AC Solid State Relay with MOSFETs Reference Design

The isolated self-powered AC solid state relay with MOSFETs reference design is a relay replacement that enables efficient power management for a low-power alternative to standard electromechanical relays. The galvanic isolation is implemented capacitively, creating a cost-efficient, reduced (...)
Design guide: PDF
Schematic: PDF
Reference designs

CC2531EM-IOT-HOME-GATEWAY-RD — ZigBee Home Automation Gateway reference design

A gateway is a bridge that connects wireless devices to the Internet. This Linux-based Home Automation Gateway enables remote monitoring and control of ZigBee® powered nodes and devices inside the home. This gateway reference design includes ZigBee Home Automation (HA 1.2) certified software (...)
Test report: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
SSOP (DCT) 8 Ultra Librarian
UQFN (RSE) 8 Ultra Librarian
VSSOP (DCU) 8 Ultra Librarian
X2SON (DQE) 8 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos