SN74CBT3306 is no longer in production
This product is no longer in production. New designs should consider an alternate product.
open-in-new Compare alternates
Pin-for-pin with same functionality to the compared device
SN74CBT3306C ACTIVE 5-V, 1:1 (SPST), 2-channel FET bus switch with –2-V undershoot protection (active low) Upgraded powered-off protection and undershoot protection support

Product details

Configuration 1:1 SPST Number of channels 2 Power supply voltage - single (V) 5 Protocols Analog Ron (typ) (Ω) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 1:1 SPST Number of channels 2 Power supply voltage - single (V) 5 Protocols Analog Ron (typ) (Ω) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
SOIC (D) 8 29.4 mm² 4.9 x 6 TSSOP (PW) 8 19.2 mm² 3 x 6.4
  • 5- Switch Connection Between Two Ports
  • TTL-Compatible Input Levels
  • 5- Switch Connection Between Two Ports
  • TTL-Compatible Input Levels

The SN74CBT3306 dual FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE\) input is high.

The SN74CBT3306 dual FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE\) input is high.

Download

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet SN74CBT3306 datasheet (Rev. H) 15 Jan 2004

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location