The TMUX7308F and TMUX7309F are modern complementary metal-oxide semiconductor (CMOS) analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as V DD = 12 V, V SS = –5 V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX7308F and TMUX7309F devices suitable for applications where power supply sequencing cannot be precisely controlled.
The device blocks fault voltage up to +60 V or –60 V relative to ground in both powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of switch input conditions and logic control status. Under normal operation conditions, if the analog input signal level on any Sx pin exceeds the supply voltage (V DD or V SS) by a threshold voltage (V T), the channel turns OFF and the Sx pin becomes high impedance. When the fault channel is selected, the drain pin (D or Dx) is pulled to the supply (V DD or V SS) that was exceeded.
The low capacitance, low charge injection, and integrated fault protection enables the TMUX7308F and TMUX7309F devices to be used in front end data acquisition applications where high performance and high robustness are both critical. The devices are available in a standard TSSOP package and smaller WQFN package (ideal if PCB space is limited).
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | TMUX730xF ±60-V Fault-Protected, 8:1 and Dual 4:1 Multiplexers with Latch-Up Immunity and 1.8-V Logic datasheet (Rev. C) | PDF | HTML | 12 Jul 2023 |
| Application brief | How to Protect a Multi-Channel RTD System using Fault Protected Multiplexers (Rev. A) | PDF | HTML | 08 Aug 2024 | |
| Application note | Protecting and Maintaining Signal Integrity in PLC Systems (Rev. A) | PDF | HTML | 22 Jul 2024 | |
| Application note | How to Handle High Voltage Common Mode Applications using Multiplexers | PDF | HTML | 03 Oct 2022 | |
| Application brief | Replace Discrete Protection and Optimize Your PLC System Protection | PDF | HTML | 03 Jan 2022 | |
| Application note | Protection Against Overvoltage Events, Miswiring, and Common Mode Voltages | PDF | HTML | 07 Oct 2021 | |
| Application note | Improving Analog Input Modules Reliability Using Fault Protected Multiplexers | PDF | HTML | 28 Sep 2021 | |
| Application note | Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) | 20 Sep 2021 |
For additional terms or required resources, click any title below to view the detail page where available.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
| WQFN (RRP) | 16 | Ultra Librarian |
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