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CD4013B-MIL

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CMOS 双通道 D 类触发器

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CD4013B-MIL

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产品详情

Number of channels 2 Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 24 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Supply current (max) (µA) 600 Features Balanced outputs, Positive input clamp diode, Standard speed (tpd > 50ns) Operating temperature range (°C) -55 to 125 Rating Military
Number of channels 2 Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 24 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Supply current (max) (µA) 600 Features Balanced outputs, Positive input clamp diode, Standard speed (tpd > 50ns) Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 14 130.4652 mm² 19.56 x 6.67
  • Asynchronous Set-Reset Capability
  • Static Flip-Flop Operation
  • Medium-Speed Operation: 16 MHz (Typical) Clock Toggle Rate at 10-V Supply
  • Standardized Symmetrical Output Characteristics
  • Maximum Input Current Of 1-µA at 18 V Over Full Package Temperature Range:
    • 100 nA at 18 V and 25°C
  • Noise Margin (Over Full Package Temperature Range):
    • 1 V at VDD = 5 V
    • 2 V at VDD = 10 V
    • 2.5 V at VDD = 15 V
  • Asynchronous Set-Reset Capability
  • Static Flip-Flop Operation
  • Medium-Speed Operation: 16 MHz (Typical) Clock Toggle Rate at 10-V Supply
  • Standardized Symmetrical Output Characteristics
  • Maximum Input Current Of 1-µA at 18 V Over Full Package Temperature Range:
    • 100 nA at 18 V and 25°C
  • Noise Margin (Over Full Package Temperature Range):
    • 1 V at VDD = 5 V
    • 2 V at VDD = 10 V
    • 2.5 V at VDD = 15 V

The CD4013B device consists of two identical, independent data-type flip-flops. Each flip-flop has independent data, set, reset, and clock inputs and Q and Q outputs. These devices can be used for shift register applications, and, by connecting Q output to the data input, for counter and toggle applications. The logic level present at the D input is transferred to the Q output during the positive-going transition of the clock pulse. Setting or resetting is independent of the clock and is accomplished by a high level on the set or reset line, respectively.

The CD4013B types are supplied in 14-pin dual-in-line plastic packages (E suffix), 14-pin small-outline packages (M, MT, M96, and NSR suffixes), and 14-pin thin shrink small-outline packages (PW and PWR suffixes).

The CD4013B device consists of two identical, independent data-type flip-flops. Each flip-flop has independent data, set, reset, and clock inputs and Q and Q outputs. These devices can be used for shift register applications, and, by connecting Q output to the data input, for counter and toggle applications. The logic level present at the D input is transferred to the Q output during the positive-going transition of the clock pulse. Setting or resetting is independent of the clock and is accomplished by a high level on the set or reset line, respectively.

The CD4013B types are supplied in 14-pin dual-in-line plastic packages (E suffix), 14-pin small-outline packages (M, MT, M96, and NSR suffixes), and 14-pin thin shrink small-outline packages (PW and PWR suffixes).
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类型 标题 下载最新的英语版本 日期
* 数据表 CD4013B CMOS Dual D-Type Flip-Flop 数据表 (Rev. E) PDF | HTML 2016年 9月 30日
应用手册 Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
用户指南 Signal Switch Data Book (Rev. A) 2003年 11月 14日
应用手册 Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 2001年 12月 3日

设计和开发

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封装 引脚 CAD 符号、封装和 3D 模型
CDIP (J) 14 Ultra Librarian
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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