产品详情

Number of channels 2 Technology family HCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL Output type Push-Pull Clock frequency (MHz) 24 Supply current (max) (µA) 40 IOL (max) (mA) 6 IOH (max) (mA) -6 Features Balanced outputs, Clear, High speed (tpd 10-50ns), Negative edge triggered, Positive input clamp diode Operating temperature range (°C) -55 to 125 Rating Catalog
Number of channels 2 Technology family HCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL Output type Push-Pull Clock frequency (MHz) 24 Supply current (max) (µA) 40 IOL (max) (mA) 6 IOH (max) (mA) -6 Features Balanced outputs, Clear, High speed (tpd 10-50ns), Negative edge triggered, Positive input clamp diode Operating temperature range (°C) -55 to 125 Rating Catalog
PDIP (N) 14 181.42 mm² 19.3 x 9.4
  • Hysteresis on Clock Inputs for Improved Noise Immunity and Increased Input Rise and Fall Times
  • Asynchronous Reset
  • Complementary Outputs
  • Buffered Inputs
  • Typical fMAX = 60MHz at VCC = 5V, CL = 15pF, TA = 25°C
  • Fanout (Over Temperature Range)
    • Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
    • Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
  • Wide Operating Temperature Range . . . -55°C to 125°C
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • HC Types
    • 2V to 6V Operation
    • High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
  • HCT Types
    • 4.5V to 5.5V Operation
    • Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
    • CMOS Input Compatibility, Il 1µA at VOL, VOH

  • Hysteresis on Clock Inputs for Improved Noise Immunity and Increased Input Rise and Fall Times
  • Asynchronous Reset
  • Complementary Outputs
  • Buffered Inputs
  • Typical fMAX = 60MHz at VCC = 5V, CL = 15pF, TA = 25°C
  • Fanout (Over Temperature Range)
    • Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
    • Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
  • Wide Operating Temperature Range . . . -55°C to 125°C
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • HC Types
    • 2V to 6V Operation
    • High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
  • HCT Types
    • 4.5V to 5.5V Operation
    • Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
    • CMOS Input Compatibility, Il 1µA at VOL, VOH

The ’HC107 and ’HCT107 utilize silicon gate CMOS technology to achieve operating speeds equivalent to LSTTL parts. They exhibit the low power consumption of standard CMOS integrated circuits, together with the ability to drive 10 LSTTL loads.

These flip-flops have independent J, K, Reset and Clock inputs and Q and Q\ outputs. They change state on the negative-going transition of the clock pulse. Reset is accomplished asynchronously by a low level input.

This device is functionally identical to the HC/HCT73 but differs in terminal assignment and in some parametric limits.

The HCT logic family is functionally as well as pin compatible with the standard LS family.

The ’HC107 and ’HCT107 utilize silicon gate CMOS technology to achieve operating speeds equivalent to LSTTL parts. They exhibit the low power consumption of standard CMOS integrated circuits, together with the ability to drive 10 LSTTL loads.

These flip-flops have independent J, K, Reset and Clock inputs and Q and Q\ outputs. They change state on the negative-going transition of the clock pulse. Reset is accomplished asynchronously by a low level input.

This device is functionally identical to the HC/HCT73 but differs in terminal assignment and in some parametric limits.

The HCT logic family is functionally as well as pin compatible with the standard LS family.

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类型 标题 下载最新的英语版本 日期
* 数据表 CD54HC107, CD74HC107, CD54HCT107, CD74HCT107 数据表 (Rev. D) 2003年 10月 21日

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包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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