The DRV824x-Q1 family of devices is a fully integrated H-bridge driver intended for a wide range of automotive applications. The DRV824x-Q1 device can be configured as a single H-bridge driver, two independent half bridge drivers. Designed in Texas Instruments' proprietary high power BiCMOS process technology node, this monolithic die device in a power package offers excellent power handling and thermal capability while providing compact package size, ease of layout, EMI control, accurate current sense, robustness and diagnostic capability. The DRV824x-Q1 has an identical pin function and register map, with scalable resistance (current capability) to support different loads with minimal design changes.
The device integrates an N-channel output stage, charge pump regulator, high side current sensing and regulation, current proportional output, and protection circuitry. A low-power sleep mode is provided to achieve ultra-low quiescent current draw by shutting down most of the internal circuitry. The device offers voltage monitoring and load diagnostics as well as protection features against output over current and device over temperature. Fault conditions are indicated on the nFAULT pin. The device is available in two interface variants - hardware (“HW”) and SPI. The HW variant uses strapping resistors for fixed configuration. The SPI variant offers more flexibility in device configuration and fault observability with an external controller.
Initial Release
Public Release of DRV824X-DRV814XEVM GUI
| Type | Title | Date | ||
|---|---|---|---|---|
| * | EVM User's guide | DRV824x_DRV814x-Q1EVM User’s Guide (Rev. D) | PDF | HTML | 27 Nov 2023 |
| Certificate | DRV8244S-Q1LEVM EU Declaration of Conformity (DoC) | 23 Jul 2021 |
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.
Initial Release
Public Release of DRV824X-DRV814XEVM GUI