For shipments to Europe, please order the equivalent signal conditioning device BOOSTXL-PGA460
The PGA460PSM evaluation module (EVM) is a small-form-factor solution showcasing double-sided printed circuit board (PCB) spacing and the supporting component requirements for the PGA460 ultrasonic sensor signal conditioner. This hardware variant can only be operated in monostatic transducer mode. Monostatic transducer mode utilizes a single transducer to both transmit and receive the ultrasonic echo.
Because the PGA460 operates exclusively as slave device, a master controller or processor device is required to configure and run the PGA460. The user's guide for this EVM focuses on the master device, and only uses the MSP-EXP430F5529LP as an example master device for demonstration purposes when paired with the BOOSTXL-PGA460 evaluation module GUI software.
TI recommends that users first evaluate the performance of the PGA460 using the PGA460-Q1 EVM GUI software and MSP-EXP430F5529LP to become familiar with the device features, then advance to the small-form-factor reference design (TIDA-060024) once transducer selection and optimization has been finalized.
PGA460 ultrasonic proximity-sensing evaluation module
| Type | Title | Date | ||
|---|---|---|---|---|
| * | EVM User's guide | PGA460PSM-EVM User's Guide | 15 Jul 2019 | |
| Data sheet | PGA460 Ultrasonic Signal Processor and Transducer Driver datasheet (Rev. C) | PDF | HTML | 10 Feb 2023 | |
| Certificate | PGA460PSM-EVM EU Declaration of Conformity (DoC) | 06 Mar 2019 | ||
| Design guide | Ultrasonic Proximity-Sensing Module (PSM) Reference Design | 09 Oct 2018 | ||
| User guide | PGA460-Q1 Ultrasonic Signal Conditioner EVM With Transducer User's Guide (Rev. B) | 19 Mar 2018 |
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.