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TIDA-00021
Intel IMVP7 3rd Generation Core Mobile (Core i7) Power Management Reference Design
TIDA-00021
Overview
The Intel® Core i7 power management design is a reference design for Intel IMVP-7 SVID. A GUI communication program is available along with several test points on the board to evaluate the static and dynamic performance of the CPU's DC/DC controller. The design features an IMVP-7 3-phase CPU supply, a 2-phase GPU Vcore supply, a 1.05-VCC IO supply, and a DDR3L/DDR4 memory rail. To greatly improve power density and thermal performance, 5-mm x 6-mm NEXFET power block MOSFETs are used.
Features
• Design supports a 9 to 20-V input from Vbatt
• Small high-density power solution for ivy bridge
• 3-phase CPU supply supports up to 94 A
• 90% peak (80% full-load) efficiency from 12 Vin to 1.05V out - CPU supply
• Low CPU supply ripple: 25 mV
• Design has been built and tested, and a board is available
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
Design files & products
Design files
Download ready-to-use system files to speed your design process.
TIDU065.PDF (5166 K)
Test results for the reference design, including efficiency graphs, test prerequisites and more
TIDR033.PDF (913 K)
Detailed schematic diagram for design layout and components
TIDR034.PDF (145 K)
Complete listing of design components, reference designators, and manufacturers/part numbers
TIDC051.ZIP (2074 K)
Design file that contains information on physical board layer of design PCB
TIDU066.PDF (3815 K)
PCB layer plot file used for generating PCB design layout
Products
Includes TI products in the design and potential alternatives.
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Technical documentation
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| Type | Title | Date | ||
|---|---|---|---|---|
| Test report | TIDA-00021 Test Results | Aug. 23, 2013 |
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