TIDA-01528
Ultra Low Power Reference Design for Secondary Protection for Over/Under Temperature Conditions
TIDA-01528
Overview
This reference design implements a secondary thermal monitoring solution for large scale battery packs. Many industry guidelines require the secondary temperature system to remain powered and operational in the event that the primary power supply is lost. This design is capable of continuing operation in a low power state by utilizing low power, factory preset thermal trip points, on a super capacitor powered backup rail. The solution ensure that any over or under temperature event can be captured and dealt with even when the main system controller's power is unavailable, increasing the safe operating window of the total system.
Features
- Ability to provide thermal monitoring and protection during normal operation or when the primary circuit has lost power
- Ultra-low power TMP303 uses just 5µA max per device
- Integrated backup power source via a SuperCap and charger
- Satisfy primary and secondary protection requirements with interface for TI cell supervisors for charge control
- Factory programmable over/under temperature trip points with hysteresis
Design files & products
Design files
Download ready-to-use system files to speed your design process.
Reference design overview and verified performance test data
Detailed overview of design layout for component placement
Complete listing of design components, reference designators, and manufacturers/part numbers
Files used for 3D models or 2D drawings of IC components
Design file that contains information on physical board layer of design PCB
PCB layer plot file used for generating PCB design layout
Detailed schematic diagram for design layout and components
Products
Includes TI products in the design and potential alternatives.
Start development
Technical documentation
| Top documentation | Type | Title | Format options | Date |
|---|---|---|---|---|
| * | Design guide | Ultra-Low-Power Design—Secondary Protection for Over/Undertemp Conditions in ESS | Dec 12, 2017 |
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.