BDE-3P-LE2340

BDE LE2340 无线模块

BDE-3P-LE2340

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概述

BDE-3P-LE2340 modules are Bluetooth® 5.3 Low Energy wireless modules based on the CC2340R. With their low cost and exceptional RF and power consumption performance, these modules are ideal for applications that are cost-sensitive and require extended battery life. Multiple variants are available to meet diverse integration needs, offering three antenna options: an ANT pin for an external antenna, a U.FL connector for an external antenna, and an integrated PCB trace antenna. The operating temperature range is -40℃ to +85℃, with an extended range of -40℃ to +105℃ for the '-IN' (extended industrial) variants. The modules come with different memory options: 512KB or 256KB for flash, 12KB or 26KB for RAM, and variants with embedded 32Mbit SPI flash memory for additional storage requirements. Depending on the variant, users can access up to 26 or 12 GPIOs.

特性
  • Bluetooth® Low Energy 5.3
  • Integrated 48-MHz Arm Cortex-M0+ processor supporting BLE 5.3, ZigBee, SimpleLink TI 15.4-stack and Proprietary systems
  • 256 KB of in-system programmable flash
  • Backwards compatibility and support for key features from Bluetooth 4.2 and earlier LE specifications
  • Antenna options:
    • External antenna
    • U.FL Connector
    • Integrated PCB
  • Operating Temperature:
    • -40 to 85°C
    • -40 to 105°C
低功耗 2.4GHz 产品
CC2340R2 具有 256kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 低功耗 Bluetooth® 无线 MCU CC2340R5 具有 512kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 低功耗 Bluetooth® 无线 MCU
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子卡

BDE-LE2340R21GE — CC2340R2 具有 12 个 GPIO 的蓝牙 2.4GHz 模块

子卡

BDE-LE2340R22KP — CC2340R2 具有 26 个 GPIO 的蓝牙 2.4GHz 模块

子卡

BDE-LE2340R52GE — CC2340R5 蓝牙 2.4GHz 模块

子卡

BDE-LE2340R52KP — CC2340R5 蓝牙 2.4GHz 模块

应遵守 TI 的评估模块标准条款与条件.

支持与培训

第三方支持
TI 不会为此硬件提供持续且直接的设计支持。要在设计期间获得支持,请联系 BDE Technology Inc..

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免责声明

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