LP-EM-CC2745R10-Q1

CC2745R10-Q1 SimpleLink™ 2.4GHz 无线 MCU LaunchPad™ 开发套件

LP-EM-CC2745R10-Q1

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概述

此 LaunchPad™ 开发套件可加快具有集成功率放大器和无线电支持(支持 2.4GHz 运行)的器件的开发速度。此 LaunchPad 配备了一个符合 AEC-Q100 标准的无线微控制器 (MCU),支持适用于汽车应用的低功耗 Bluetooth®(5.3 和即将推出的版本)。这是一个分离式 LaunchPad™ 开发套件,意味着不包含 XDS 调试器。推荐使用 LP-XDS110 或 LP-XDS110ET 调试器。

特性
  • 适用于带有集成式 PCB 布线天线的无线应用、具有 2.4GHz 无线电的 LaunchPad™ 开发套件
  • 协议支持包括低功耗 Bluetooth® 和 2.4GHz 专有射频
  • 需要单独购买用于软件开发和射频评估的调试器(LP-XDS110 或 LP-XDS110ET)
低功耗 2.4GHz 产品
CC2755R10 具有 1MB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M33 低功耗 Bluetooth® 无线 MCU

 

汽车类无线连接产品
CC2745P10-Q1 具有 1MB 闪存、HSM、APU、CAN-FD 和 +20dBm 的汽车级 SimpleLink™ 低功耗 Bluetooth® 6.0 无线 MCU CC2745R10-Q1 具有 1MB 闪存、HSM、APU 和 CAN-FD 的汽车级 SimpleLink™ 低功耗 Bluetooth® 6.0 无线 MCU
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LP-EM-CC2745R10-Q1 — CC2745R10-Q1 SimpleLink™ 2.4GHz 无线 MCU LaunchPad™ 开发套件

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支持软件

SMARTRF-STUDIO-8 — SmartRF Studio 8 application software for CC23xx and CC27xx devices

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SMARTRF-STUDIO-8 SmartRF Studio 8 application software for CC23xx and CC27xx devices

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最新版本
版本: 1.2.0
发布日期: 13 十二月 2024
download Qt 5.15.2 source files  — 572939 K

Compressed source file archive

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download libusb-1.0.20 source files  — 456 K

Compressed source file archive

校验和

校验和
产品
低功耗 2.4GHz 产品
CC2340R5 具有 512kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 2.4GHz 无线 MCU CC2340R2 具有 256kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 2.4GHz 无线 MCU CC2755R10 具有 1MB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M33 低功耗 Bluetooth® 无线 MCU
汽车类无线连接产品
CC2340R5-Q1 具有 512kB 闪存、符合汽车标准的 SimpleLink™ 低功耗 Bluetooth® 无线 MCU CC2745P10-Q1 具有 1MB 闪存、HSM、APU、CAN-FD 和 +20dBm 的汽车级 SimpleLink™ 低功耗 Bluetooth® 6.0 无线 MCU CC2745R10-Q1 具有 1MB 闪存、HSM、APU 和 CAN-FD 的汽车级 SimpleLink™ 低功耗 Bluetooth® 6.0 无线 MCU
硬件开发
评估板
LP-EM-CC2340R5 CC2340R5 SimpleLink™ 低功耗 Bluetooth® 5.3 MCU LaunchPad™ 开发套件 LP-EM-CC2745R10-Q1 CC2745R10-Q1 SimpleLink™ 2.4GHz 无线 MCU LaunchPad™ 开发套件

发布信息

SmartRF Studio 8 is an application tool that allows users to configure, test and evaluate Simplelink RF devices from Texas Instruments. The application helps RF designers to easily evaluate the radio at an early stage in the design process. SmartRF Studio can be used either as a standalone application or together with supported evaluation boards or debug probes for the RF device.

最新信息

  • New device support: CC2745R10Q1, CC2745P10Q1, CC2744R7Q1, CC2745R7Q1, CC2755R10 and CC2755P10 devices
  • New SDK support with updated PHY settings: SimpleLink Low Power F3 SDK 8.20.00 and SimpleLink Low Power F3 SDK 8.40.00
  • Added packet view that shows all parts of the transmitted packet (for example, preamble, synchronization word, header, payload and CRC)
  • Miscellaneous improvements and bug-fixes
软件开发套件 (SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

支持的产品和硬件
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SIMPLELINK-LOWPOWER-F3-SDK SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

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最新版本
版本: 8.40.02.01
发布日期: 28 二月 2025

校验和

校验和

校验和
download Linux Zip for SimpleLink Low Power F3 SDK  — 449680 K

校验和

校验和
download macOS Zip for SimpleLink Low Power F3 SDK  — 436517 K

校验和
产品
低功耗 2.4GHz 产品
CC2340R2 具有 256kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 2.4GHz 无线 MCU CC2340R5 具有 512kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 2.4GHz 无线 MCU CC2755R10 具有 1MB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M33 低功耗 Bluetooth® 无线 MCU
汽车类无线连接产品
CC2340R5-Q1 具有 512kB 闪存、符合汽车标准的 SimpleLink™ 低功耗 Bluetooth® 无线 MCU CC2745P10-Q1 具有 1MB 闪存、HSM、APU、CAN-FD 和 +20dBm 的汽车级 SimpleLink™ 低功耗 Bluetooth® 6.0 无线 MCU CC2745R10-Q1 具有 1MB 闪存、HSM、APU 和 CAN-FD 的汽车级 SimpleLink™ 低功耗 Bluetooth® 6.0 无线 MCU
硬件开发
评估板
LP-EM-CC2340R5 CC2340R5 SimpleLink™ 低功耗 Bluetooth® 5.3 MCU LaunchPad™ 开发套件 LP-EM-CC2745R10-Q1 CC2745R10-Q1 SimpleLink™ 2.4GHz 无线 MCU LaunchPad™ 开发套件

发布信息

The SimpleLink™ Low Power F3 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC23xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC23xx wireless MCU users by packaging essential software components, such as:

  • Bluetooth® Low Energy (BLE) protocol stack

  • Zigbee® protocol stack supporting low power wireless mesh networks

  • Proprietary RF layer

  • TI Drivers

All of the above are provided in one easy-to-use software package along with example applications and documentation.

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit TI SimpleLink Wireless Connectivity.

This is version 8.40.02.01 of the SimpleLink Low Power F3 SDK.

Supported Features and Limitations

CC23xx

TI Crypto Driver Overview Support Status Additional Comment AES-CCM Supported AES-ECB Supported AESECB_oneStepDecrypt, AESECB_setupDecrypt not supported AES-GCM Supported AES-CTR Supported AES-CBC Supported AESCBC_oneStepDecrypt, AESCBC_setupDecrypt not supported AES-CTR-DRBG Supported AES-CMAC Supported SHA-256 Supported ECDH Supported ECIES Supported RNG Supported TRNG Not Supported

CC27xx

TI Crypto Driver Overview Support Status Additional Comment AES-CCM Supported LAES + HSM AES-ECB Supported LAES + HSM AES-GCM Supported LAES + HSM AES-CTR Supported LAES + HSM AES-CBC Supported LAES + HSM AES-CTR-DRBG Not Supported This is supported via RNG AES-CMAC Supported LAES + HSM ECDH Supported HSM ECDSA Supported HSM RNG Supported HSM (AES-CTR-DRBG) TRNG Supported HSM

LAES & HSM Limitations

The CC27xx family of devices now include a Hardware Security Module (HSM) for cryptographic and key storage features.

For crypto drivers that support the HSM and LAES, a failure in the HSM bootup process will be cached in the driver’s handle. If the user attempts to perform an HSM operation later, it will return an error due to the cached initialization error. LAES operations would continue to function without issue in that case.

For drivers that support running operations on both hardware accelerators, a switch has been implemented so that the driver knows which engine to use to execute the operation on. This switch is part of the cryptography operation’s key. The key encoding associated with each key that is included as part of the user-provided data to the driver is where the user can specify which hardware accelerator to use.

  • To leverage the HSM hardware accelerator, the user has to call ‘CryptoKeyPlaintextHSM_initKey(..)’ API and pass in the plaintext key as well as the key length.

  • To leverage the LAES hardware accelerator, the user has to call ‘CryptoKeyPlaintext_initKey()(..)’ API and pass in the plaintext key as well as the key length.

NOTE:

  • Mass erasing the CC27xx without retaining protected sectors will result in the erasure of the HSM firmware. Please see the Quick Start Guide: Build your first program for the CC23xx or CC27xx device on how to re-flash the HSM firmware.

最新信息

  • Certified Zigbee Stack.

  • Zigbee OTA support.

  • Minor bug fixes in SCCM.

应遵守 TI 的评估模块标准条款与条件.

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类型 标题 下载最新的英文版本 日期
证书 LP-EM-CC2745R10-Q1 EU Declaration of Conformity (DoC) 2024年 11月 13日
更多文献资料 LP-EM-CC2745R10-Q1 Quick Start Guide 2023年 11月 7日

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