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PROCESSOR-SDK-LINUX-AM62P

Processor SDK Linux for AM62P

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最新版本
版本: 10.00.07.04
发布日期: 14 八月 2024

Processor SDK LINUX AM62P - Linux Installer for sources, pre-built binaries and file system images generated using Yocto build environment

MD5 校验和

Processor SDK LINUX AM62P Yocto - SD card image

MD5 校验和

Processor SDK LINUX AM62P Display Cluster Yocto - SD card image

MD5 校验和

Processor SDK LINUX AM62P Jailhouse Hypervisor - SD card image

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Processor SDK LINUX AM62P Debian Trixie - SD card image

MD5 校验和
产品
基于 Arm 的处理器
AM62P 具有三路显示、3D 图形和 4K 视频编解码器且适用于人机界面的 Arm®Cortex®-A53 SoC AM62P-Q1 具有高级 3D 图形、4K 视频编解码器和嵌入式安全功能的汽车显示 SoC
硬件开发
评估板
SK-AM62P-LP AM62P 入门套件评估模块

文档

Quick Start Guide for the AM62P EVM board

Learn how to build embedded Linux systems using AM62P processors

Yocto SDK user manual for developers

Instructions to build Linux image for AM62P EVM using Yocto build environment

Debian SDK manual for developers with build instructions

Get the various Linux Performance Benchmarks for this release

Processor SDK AM62P for Yocto Linux - Software manifest

Processor SDK AM62P for Debian Linux - Software manifest

Processor SDK AM62P for Jailhouse Hypervisor - Software manifest

Build Sheet of supported features for AM62P

发布信息

Thank you for your interest in PROCESSOR SDK LINUX AM62P Software Development Kit (SDK). This SDK is a Linux only package. The Processor SDK is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly reuse and develop software across devices.

This release adds support for High Security - Field Securable (HS-FS) devices.

TI Linux CI/CD Snapshot

AM62P Snapshot

In order to improve access to the very latest bug fixes and feature enhancements, TI is enabling Continuous Integration and Continuous Deployment (CI/CD) for AM62P processors. The patches for these changes have always been available on public repositories hosted on git.ti.com, and these source repositories could be built using the Yocto build environment on a daily basis. The new TI Linux CI/CD Snapshot makes it even easier to consume these changes with pre-built binaries of Linux boot images to try out on TI Evaluation Modules (EVMs and SKs) before migrating or picking the patches. A detailed test report is also published to help users understand the status of the build and features being validated. The Linux boot images from a snapshot can be regenerated using sources by following the build instructions provided on the snapshot page.

The daily snapshot is not a replacement for the official Processors SDK releases which have full documentation, training and support. The snapshot is a new easy way to try bug fixes and feature enhancements planned for the next SDK while enabling much more tighter integration with customizations and application development. This improved integration should allow users to release their customized code built  on the SDKs more quickly and confidently.

最新动态

  • Linux embedded software support, long-term Stable (LTS) Linux kernel v6.6 support & Board support package
  • Yocto Scarthgap (LTS) based build environment and filesystem
  • Debian distribution upgraded to Trixie from Bookworm and pre-built deb packages
  • LTS migration of Linux based Jailhouse hypervisor support
  • Uboot 2024.04 based bootloaders
  • Improvements to Real-Time Linux Interrupt Latency
  • SDK integration of CC33xx driver with LTS 6.6 Kernel
  • Low Power Mode Software Re-architecture - Suitable for upstreaming Linux code