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ESD351

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1.8-pF, 3.3V, ±30-kV ESD protection diode with 6.5-V, 16-A TLP clamping in 0402 package for USB 2.0

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Data sheet

ESD351

ACTIVE
Data sheet Order now

Product details

Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 36 Vrwm (V) 3.6 Bi-/uni-directional Uni-Directional Number of channels 1 IO capacitance (typ) (pF) 1.8 IEC 61000-4-2 contact (±V) 30000 IEC 61000-4-5 (A) 6 Features ESD Protection Clamping voltage (V) 6.5 Dynamic resistance (typ) 0.1 Interface type Audio, GPIO, USB 2.0 Breakdown voltage (min) (V) 4.5 IO leakage current (max) (nA) 10 Rating Catalog Operating temperature range (°C) -40 to 125
Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 36 Vrwm (V) 3.6 Bi-/uni-directional Uni-Directional Number of channels 1 IO capacitance (typ) (pF) 1.8 IEC 61000-4-2 contact (±V) 30000 IEC 61000-4-5 (A) 6 Features ESD Protection Clamping voltage (V) 6.5 Dynamic resistance (typ) 0.1 Interface type Audio, GPIO, USB 2.0 Breakdown voltage (min) (V) 4.5 IO leakage current (max) (nA) 10 Rating Catalog Operating temperature range (°C) -40 to 125
X1SON (DPY) 2 0.6 mm² 1 x 0.6
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±30-kV Contact Discharge
    • ±30-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 6 A (8/20 µs)
  • IO Capacitance: 1.8 pF (Typical)
  • DC Breakdown Voltage: 4.5 V (Minimum)
  • Low Leakage Current: 0.1 nA (Typical)
  • Extremely Low ESD Clamping Voltage
    • 6.5 V at 16-A TLP (I/O Pin to GND)
    • RDYN: 0.1 Ω (I/O Pin to GND)
  • Industrial Temperature Range: –40°C to +125°C
  • Industry Standard 0402 Package (DFN1006P2)
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±30-kV Contact Discharge
    • ±30-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 6 A (8/20 µs)
  • IO Capacitance: 1.8 pF (Typical)
  • DC Breakdown Voltage: 4.5 V (Minimum)
  • Low Leakage Current: 0.1 nA (Typical)
  • Extremely Low ESD Clamping Voltage
    • 6.5 V at 16-A TLP (I/O Pin to GND)
    • RDYN: 0.1 Ω (I/O Pin to GND)
  • Industrial Temperature Range: –40°C to +125°C
  • Industry Standard 0402 Package (DFN1006P2)

The ESD351 is a uni-directional TVS ESD protection diode featuring low dynamic resistance RDYN and low clamping voltage. The ESD351 is rated to dissipate ESD strikes up to 30 kV (Contact and Air) level per the IEC 61000-4-2 standard. The ultra-low dynamic resistance (0.1 Ω) and extremely low clamping voltage (6.5 V at 16-A TLP) ensure system level protection against transient events. This device has a capacitance of 1.8 pF (typical) making it ideal for protecting interfaces such as USB 2.0.

The ESD351 is offered in the industry standard 0402 (DPY/DFN1006P2) package.

The ESD351 is a uni-directional TVS ESD protection diode featuring low dynamic resistance RDYN and low clamping voltage. The ESD351 is rated to dissipate ESD strikes up to 30 kV (Contact and Air) level per the IEC 61000-4-2 standard. The ultra-low dynamic resistance (0.1 Ω) and extremely low clamping voltage (6.5 V at 16-A TLP) ensure system level protection against transient events. This device has a capacitance of 1.8 pF (typical) making it ideal for protecting interfaces such as USB 2.0.

The ESD351 is offered in the industry standard 0402 (DPY/DFN1006P2) package.
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Technical documentation

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* Data sheet ESD351 1-Channel 30 kV ESD Protection Diode with Low Clamping Voltage in 0402 Package datasheet PDF | HTML 13 Mar 2018
Application brief ESD Protection for GPIO PDF | HTML 08 Jan 2024
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 18 Aug 2022
White paper Demystifying surge protection 06 Nov 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ESDEVM — ESD evaluation module

The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested. For typical (...)
User guide: PDF | HTML
Not available on TI.com
Simulation model

ESD351 S-Parameter Model

SLVMCQ4.ZIP (20 KB) - S-Parameter Model
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Test report: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
X1SON (DPY) 2 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

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