The SN74CB3Q3306A device is a high-bandwidth FET bus switch using a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the SN74CB3Q3306A device provides an optimized interface option appropriate for broadband communications, networking, and data-intensive computing systems.
The SN74CB3Q3306A device is organized as two 1-bit switches with separate output-enable (1 OE, 2 OE) inputs. It can be used as two 1-bit bus switches or as one 2-bit bus switch. When OE is low, the associated 1-bit bus switch is ON and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the associated 1-bit bus switch is OFF, and a high-impedance state exists between the A and B ports.
The SN74CB3Q3306A device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging current backflow through the device when it is powered down. The device has isolation during power off.
To confirm the high-impedance state during power up or power down, OE must be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
| Top documentation | Type | Title | Format options | Date |
|---|---|---|---|---|
| * | Data sheet | SN74CB3Q3306A Dual FET Bus Switch 2.5V/3.3V Low-Voltage High-Bandwidth Bus Switch datasheet (Rev. F) | PDF | HTML | Sep 24, 2026 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | Jun 2, 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | Dec 1, 2021 | |
| Application brief | Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) | PDF | HTML | Jan 6, 2021 |
For additional terms or required resources, click any title below to view the detail page where available.
Speed up your op amp prototyping and testing with the DIP adapter evaluation module (DIP-ADAPTER-EVM), which provides a fast, easy and inexpensive way to interface with small surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them (...)
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
This is a reference design for high-reliability, low-latency network communications for substation automation equipment in smart grid transmission and distribution networks. It supports the parallel redundancy protocol (PRP) specification in the IEC 62439 standard using the PRU-ICSS. This reference (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| TSSOP (PW) | 8 | Ultra Librarian |
| VSSOP (DCU) | 8 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.