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SN74CBT3126

ACTIVE

5-V, 1:1 (SPST), 4-channel general-purpose FET bus switch with st&ard '126-type pinout

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Data sheet

SN74CBT3126

ACTIVE
Data sheet Order now

Product details

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5 Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Ron (typ) (Ω) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5 Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Ron (typ) (Ω) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
SOIC (D) 14 51.9 mm² 8.65 x 6 SSOP (DB) 14 48.36 mm² 6.2 x 7.8 SSOP (DBQ) 16 29.4 mm² 4.9 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4 VQFN (RGY) 14 12.25 mm² 3.5 x 3.5
  • Standard ’126-Type Pinout (D, DB, DGV, and PW Packages)
  • 5- Switch Connection Between Two Ports
  • TTL-Compatible Input Levels
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Standard ’126-Type Pinout (D, DB, DGV, and PW Packages)
  • 5- Switch Connection Between Two Ports
  • TTL-Compatible Input Levels
  • Latch-Up Performance Exceeds 250 mA Per JESD 17

The SN74CBT3126 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE) input is low.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pullup resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

The SN74CBT3126 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE) input is low.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pullup resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
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Technical documentation

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Type Title Date
* Data sheet SN74CBT3126 datasheet (Rev. K) 06 Oct 2003
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
More literature Digital Bus Switch Selection Guide (Rev. A) 10 Nov 2004
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
More literature CBT RAID Application Clip 12 Jun 2003
Application note Bus FET Switch Solutions for Live Insertion Applications 07 Feb 2003
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Flexible Voltage-Level Translation With CBT Family Devices 20 Jul 1999
User guide CBT (5-V) And CBTLV (3.3-V) Bus Switches Data Book (Rev. B) 01 Dec 1998
Application note 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A) 03 Apr 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note 5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B) 01 Mar 1997
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Package Pins CAD symbols, footprints & 3D models
SOIC (D) 14 Ultra Librarian
SSOP (DB) 14 Ultra Librarian
SSOP (DBQ) 16 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian
VQFN (RGY) 14 Ultra Librarian
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