PowerPAD is a trademark of Texas Instruments.
Microsim PARTS is a trademark of MicroSim Corporation.
Microsim PSpice is a registered trademark of MicroSim Corporation.
All other trademarks are the property of their respective owners.
The TLV247x is a family of CMOS rail-to-rail input/ output operational amplifiers that establishes a new performance point for supply current versus ac performance. These devices consume just 600µA/channel while offering 2.8MHz of gain-bandwidth product. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower operational amplifiers. The TLV247x can swing to within 180mV of each supply rail while driving a 10mA load. For non-RRO applications, the TLV247x can supply ±35mA at 500mV off the rail. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV247x family ideal for sensor interface, portable medical equipment, and other data acquisition circuits.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | Family of 600uA/Ch 2.8MHz Rail-to-Rail I/O High-Drive Op Amps with Shutdown datasheet (Rev. E) | 03 Jul 2007 | |
| Application note | Conditioning a Switch-mode Power Supply Current Signal Using TI Op Amps (Rev. A) | PDF | HTML | 11 Jun 2021 | |
| E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 28 Mar 2017 | ||
| Application note | Use of Rail-to-Rail Operational Amplifiers (Rev. A) | 22 Dec 1999 |
For additional terms or required resources, click any title below to view the detail page where available.
The amplifier performance development kit (PDK) is an evaluation module (EVM) kit to test common operational amplifier (op amp) parameters and is compatible with most op amps and comparators. The EVM kit offers a main board with several socketed daughtercard options to fit package needs, allowing (...)
Speed up your op amp prototyping and testing with the DIP adapter evaluation module (DIP-ADAPTER-EVM), which provides a fast, easy and inexpensive way to interface with small surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them (...)
The DIYAMP-EVM is an evaluation module (EVM) family that provides engineers and do it yourselfers (DIYers) with real-world amplifier circuits, enabling you to quickly evaluate design concepts and verify simulations. It is available in three industry-standard packages (SC70, SOT-23 and SOIC) (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| PDIP (P) | 8 | Ultra Librarian |
| SOIC (D) | 8 | Ultra Librarian |
| SOT-23 (DBV) | 5 | Ultra Librarian |
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.