Product details

Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 5, 12, 16, 20, 36 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 4 CON (typ) (pF) 180 ON-state leakage current (max) (µA) 0.025 Supply current (typ) (µA) 35 Bandwidth (MHz) 33 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 300 Rating Catalog Drain supply voltage (max) (V) 36 Supply voltage (max) (V) 36 Negative rail supply voltage (max) (V) -18
Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 5, 12, 16, 20, 36 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 4 CON (typ) (pF) 180 ON-state leakage current (max) (µA) 0.025 Supply current (typ) (µA) 35 Bandwidth (MHz) 33 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 300 Rating Catalog Drain supply voltage (max) (V) 36 Supply voltage (max) (V) 36 Negative rail supply voltage (max) (V) -18
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RUM) 16 16 mm² 4 x 4
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Technical documentation

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Type Title Date
* Data sheet TMUX620x 36 V, Low-Ron, 8:1 1-Channel and 4:1, 2-Channel Precision Multiplexers with 1.8 V Logic datasheet (Rev. E) PDF | HTML 11 Jul 2024
Application note How to Handle High Voltage Common Mode Applications using Multiplexers PDF | HTML 03 Oct 2022
Product overview PLC Analog Input Front-End Architectures PDF | HTML 31 Jul 2022
Application brief Dynamically Controlling Signal in a CWD Receive Path for Ultrasound PDF | HTML 18 Jan 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Simulation model

TMUX6208 IBIS Model (Rev. A)

SCDM251A.ZIP (237 KB) - IBIS Model
Simulation model

TMUX6208 PSpice Model

SCDM286.ZIP (238 KB) - PSpice Model
Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 16 Ultra Librarian
WQFN (RUM) 16 Ultra Librarian

Ordering & quality

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Support & training

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