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TMUX7612

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50V, 1.3Ω RON, 1:1 (SPST) four-channel precision multiplexer with 1.8V logic

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Data sheet

TMUX7612

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Data sheet Order now

Product details

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44, 50 Power supply voltage - dual (V) +/- 25, +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 1.35 CON (typ) (pF) 24 ON-state leakage current (max) (µA) 0.0005 Supply current (typ) (µA) 150 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make Input/output continuous current (max) (mA) 450 Rating Catalog Drain supply voltage (max) (V) 25 Supply voltage (max) (V) 50 Negative rail supply voltage (max) (V) -25
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44, 50 Power supply voltage - dual (V) +/- 25, +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 1.35 CON (typ) (pF) 24 ON-state leakage current (max) (µA) 0.0005 Supply current (typ) (µA) 150 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make Input/output continuous current (max) (mA) 450 Rating Catalog Drain supply voltage (max) (V) 25 Supply voltage (max) (V) 50 Negative rail supply voltage (max) (V) -25
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RUM) 16 16 mm² 4 x 4
  • Dual supply range: ±4.5 V to ±25 V
  • Single supply range: 4.5 V to 50 V
  • Asymmetric dual supply support (For example: V DD = 37.5 V, V SS = 12.5 V)
  • Precision performance:
    • Low on-resistance: 1.35 Ω (typical)
    • Low capacitance: 35 pF (typical)
    • Ultra-low on-resistance flatness: 0.01 Ω (typical)
    • High current support: 470 mA (maximum)
    • Low on-leakage current: 3.7 pA (typical), 0.5 nA (maximum)
    • Low off-leakage current: 30 pA (typical), 0.25 nA (maximum)
    • Ultra-low charge injection: 10 pC (typical)
  • –40°C to +125°C operating temperature
  • Rail-to-rail operation
  • Bidirectional operation
  • Break-before-make switching
  • Dual supply range: ±4.5 V to ±25 V
  • Single supply range: 4.5 V to 50 V
  • Asymmetric dual supply support (For example: V DD = 37.5 V, V SS = 12.5 V)
  • Precision performance:
    • Low on-resistance: 1.35 Ω (typical)
    • Low capacitance: 35 pF (typical)
    • Ultra-low on-resistance flatness: 0.01 Ω (typical)
    • High current support: 470 mA (maximum)
    • Low on-leakage current: 3.7 pA (typical), 0.5 nA (maximum)
    • Low off-leakage current: 30 pA (typical), 0.25 nA (maximum)
    • Ultra-low charge injection: 10 pC (typical)
  • –40°C to +125°C operating temperature
  • Rail-to-rail operation
  • Bidirectional operation
  • Break-before-make switching

The TMUX7612 is a complementary metal-oxide semiconductor (CMOS) switch device with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The device works with a single supply (4.5 V to 50 V), dual supplies (±4.5 V to ±25 V), or asymmetric supplies (such as V DD = 37.5 V, V SS = –12.5 V). The TMUX7612 supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from V SS to V DD.

The switches of the TMUX7612 are controlled with appropriate logic control inputs on the SELx pins. The TMUX7612 features a special architecture which allows for ultra-low charge injection. This feature helps prevent unwanted coupling from the control input to the analog output of the device and reduces AC noise and offset errors.

The TMUX7612 is a part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.

The TMUX7612 is a complementary metal-oxide semiconductor (CMOS) switch device with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The device works with a single supply (4.5 V to 50 V), dual supplies (±4.5 V to ±25 V), or asymmetric supplies (such as V DD = 37.5 V, V SS = –12.5 V). The TMUX7612 supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from V SS to V DD.

The switches of the TMUX7612 are controlled with appropriate logic control inputs on the SELx pins. The TMUX7612 features a special architecture which allows for ultra-low charge injection. This feature helps prevent unwanted coupling from the control input to the analog output of the device and reduces AC noise and offset errors.

The TMUX7612 is a part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.
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* Data sheet TMUX7612 50 V, Low-RON, 1:1 (SPST), 4-Channel Precision Switches with 1.8-V Logic datasheet PDF | HTML 08 Aug 2023

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TMUX-24PW-EVM — TMUX generic evaluation module for 16-, 20- and 24-pin PW thin shrink small-outline packages (TSSOP)

The TMUX-24PW-EVM evaluation module allows for the quick prototyping and DC characterization of the TI line of TMUX products that use 16-, 20- or 24-pin TSSOP packages (PW) and is rated for high-voltage operation.

User guide: PDF | HTML
Not available on TI.com
Evaluation board

TMUXRUM-RRPEVM — TMUX generic evaluation module for 16-pin RUM and RRP quad-flatpack no-lead (QFN) packages

The TMUXRUM-RRPEVM allows for the quick prototyping and DC characterization of  the TI line of TMUX products that use 16-pin RUM or RRP packages (QFN) and is rated for high-voltage operation.

User guide: PDF | HTML
Not available on TI.com
Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
Not available on TI.com
Simulation model

TMUX7612 IBIS Model

SCDM325.ZIP (30 KB) - IBIS Model
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Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 16 Ultra Librarian
WQFN (RUM) 16 Ultra Librarian
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