Home Switches & multiplexers Analog switches & muxes Protocol & bus switches & muxes
Home
Switches & multiplexers
Analog switches & muxes
Protocol & bus switches & muxes

TS3USB3031

ACTIVE

DP3T USB 2.0 High-Speed and Mobile High-Definition Link (MHL) (6.5GHz) Switch

Order now
Data sheet

TS3USB3031

ACTIVE
Data sheet Order now

Product details

Protocols MHL, USB 2.0 Configuration 3:1 Number of channels 2 USB speed (Mbps) 480 Bandwidth (MHz) 6500 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 2.5 Ron (typ) (mΩ) 4500 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 28 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 85 COFF (typ) (pF) 0.8 CON (typ) (pF) 1 Off isolation (typ) (dB) -38 OFF-state leakage current (max) (µA) 2 Ron (max) (mΩ) 6000 Turnoff time (disable) (max) (ns) 0.1 Turnon time (enable) (max) (ns) 0.1 Rating Catalog
Protocols MHL, USB 2.0 Configuration 3:1 Number of channels 2 USB speed (Mbps) 480 Bandwidth (MHz) 6500 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 2.5 Ron (typ) (mΩ) 4500 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 28 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 85 COFF (typ) (pF) 0.8 CON (typ) (pF) 1 Off isolation (typ) (dB) -38 OFF-state leakage current (max) (µA) 2 Ron (max) (mΩ) 6000 Turnoff time (disable) (max) (ns) 0.1 Turnon time (enable) (max) (ns) 0.1 Rating Catalog
WQFN (RMG) 12 3.24 mm² 1.8 x 1.8
  • VCC range: 2.5V to 4.3V
  • Mobile high-definition link (MHL) or mobility display port (MyDP) switch:
    • Bandwidth (–3dB): 6.5GHz
    • RON (typical): 5.5Ω
    • CON (typical): 1.3pF
  • USB switches (2 sets):
    • Bandwidth (–3dB): 6.5GHz
    • RON (typical): 4.5Ω
    • CON (typical): 1pF
  • Current consumption: 28µA (typical)
  • Special features:
    • IOFF protection prevents current leakage in powered-down state (VCC = 0V)
    • 1.8V compatible control inputs (SEL)
    • Overvoltage tolerance (OVT) on all I/O pins up to 5.5V without external components
  • ESD performance:
    • 2kV human-body model (A114B, class II)
    • 1kV charged-device model (C101)
  • Package:
    • 12-pin VQFN package (1.8mm × 1.8mm, 0.4mm pitch)
  • VCC range: 2.5V to 4.3V
  • Mobile high-definition link (MHL) or mobility display port (MyDP) switch:
    • Bandwidth (–3dB): 6.5GHz
    • RON (typical): 5.5Ω
    • CON (typical): 1.3pF
  • USB switches (2 sets):
    • Bandwidth (–3dB): 6.5GHz
    • RON (typical): 4.5Ω
    • CON (typical): 1pF
  • Current consumption: 28µA (typical)
  • Special features:
    • IOFF protection prevents current leakage in powered-down state (VCC = 0V)
    • 1.8V compatible control inputs (SEL)
    • Overvoltage tolerance (OVT) on all I/O pins up to 5.5V without external components
  • ESD performance:
    • 2kV human-body model (A114B, class II)
    • 1kV charged-device model (C101)
  • Package:
    • 12-pin VQFN package (1.8mm × 1.8mm, 0.4mm pitch)

The TS3USB3031 device is a 2-channel, 1:3 multiplexer that includes a high-speed Mobile High-Definition Link (MHL), Mobility Display Port (MyDP) switch, and USB 2.0 High-Speed (480Mbps) switches in the same package. These configurations allow the system designer to save board space and eliminate multiple connectors buy using a common USB or Mico-USB connector for MHL/MyDP signals and two sets of USB data. The MHL/MyDP path supports the latest MHL Rev. 3.0 specification.

The TS3USB3031 has a VCC range of 2.5V to 4.3V and supports overvoltage tolerance (OVT) feature, which allows the I/O pins to withstand overvoltage conditions (up to 5.5V). The power-off protection feature forces all I/O pins to be in high impedance mode when power is not present, allowing full isolation of the signals lines under such condition without excessive leakage current. The select pins of TS3USB3031 are compatible with 1.8V control voltage, allowing them to be directly interfaced with the General Purpose I/O (GPIO) from a mobile processor with out needing additional voltage level shifting circuitry.

The TS3USB3031 is available in a small 1.8mm × 1.8mm 12-pin VQFN package designed for mobile applications.

The TS3USB3031 device is a 2-channel, 1:3 multiplexer that includes a high-speed Mobile High-Definition Link (MHL), Mobility Display Port (MyDP) switch, and USB 2.0 High-Speed (480Mbps) switches in the same package. These configurations allow the system designer to save board space and eliminate multiple connectors buy using a common USB or Mico-USB connector for MHL/MyDP signals and two sets of USB data. The MHL/MyDP path supports the latest MHL Rev. 3.0 specification.

The TS3USB3031 has a VCC range of 2.5V to 4.3V and supports overvoltage tolerance (OVT) feature, which allows the I/O pins to withstand overvoltage conditions (up to 5.5V). The power-off protection feature forces all I/O pins to be in high impedance mode when power is not present, allowing full isolation of the signals lines under such condition without excessive leakage current. The select pins of TS3USB3031 are compatible with 1.8V control voltage, allowing them to be directly interfaced with the General Purpose I/O (GPIO) from a mobile processor with out needing additional voltage level shifting circuitry.

The TS3USB3031 is available in a small 1.8mm × 1.8mm 12-pin VQFN package designed for mobile applications.
filter Find other Protocol & bus switches & muxes
Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 4
Type Title Date
* Data sheet TS3USB3031 2-Channel, 1:3, USB 2.0 High-Speed (480Mbps) and Mobile High-Definition Link (MHL) or Mobility Display Port (MyDP) Switch datasheet (Rev. D) PDF | HTML 01 Aug 2024
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs (Rev. A) PDF | HTML 08 Jan 2026
Application note Passive Mux Selection Based On Bandwidth (Rev. A) PDF | HTML 31 Jul 2024
Application note TMDS Clock Detection Solution in HDMI Sink Applications 23 Aug 2017

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

TS3USB3031 HSpice Model

SCDJ045.ZIP (614 KB) - HSpice Model
Download
Simulation model

TS3USB3031RMGR S-Parameter Model

SCDM192.ZIP (446 KB) - S-Parameter Model
Download
Package Pins CAD symbols, footprints & 3D models
WQFN (RMG) 12 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos