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D 型锁存器

SN54ALS563B

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具有三态输出的八路 D 类透明锁存器

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SN54ALS563B

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产品详情

Number of channels 8 Technology family ALS Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type Bipolar Output type 3-State Clock frequency (max) (MHz) 75 IOL (max) (mA) 12 IOH (max) (mA) -1 Supply current (max) (µA) 29000 Features Flow-through pinout, High speed (tpd 10-50ns), Inverting output Operating temperature range (°C) -55 to 125 Rating Military
Number of channels 8 Technology family ALS Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type Bipolar Output type 3-State Clock frequency (max) (MHz) 75 IOL (max) (mA) 12 IOH (max) (mA) -1 Supply current (max) (µA) 29000 Features Flow-through pinout, High speed (tpd 10-50ns), Inverting output Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 20 167.464 mm² 24.2 x 6.92
  • 3-State Buffer-Type Outputs Drive Bus Lines Directly
  • Bus-Structured Pinout
  • 3-State Buffer-Type Outputs Drive Bus Lines Directly
  • Bus-Structured Pinout

These 8-bit D-type transparent latches feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

While the latch-enable (LE) input is high, the Q outputs follow the complements of data (D) inputs. When LE is taken low, the outputs are latched at the inverses of the levels set up at the D inputs.

A buffered output-enable (OE)\ input places the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased high logic level provide the capability to drive bus lines without interface or pullup components.

OE\ does not affect internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

These 8-bit D-type transparent latches feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

While the latch-enable (LE) input is high, the Q outputs follow the complements of data (D) inputs. When LE is taken low, the outputs are latched at the inverses of the levels set up at the D inputs.

A buffered output-enable (OE)\ input places the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased high logic level provide the capability to drive bus lines without interface or pullup components.

OE\ does not affect internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
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类型 标题 下载最新的英语版本 日期
* 数据表 SN54ALS563B, SN74ALS563B 数据表 (Rev. B) 2004年 11月 4日
* SMD SN54ALS563B SMD 5962-88700 2016年 6月 21日
应用手册 Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
应用手册 Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
应用手册 使用逻辑器件进行设计 (Rev. C) 1997年 6月 1日
应用手册 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
应用手册 Live Insertion 1996年 10月 1日
应用手册 Advanced Schottky (ALS and AS) Logic Families 1995年 8月 1日

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CDIP (J) 20 Ultra Librarian
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  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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  • 制造厂地点
  • 封装厂地点

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