BDE-3P-BDM209B

BDE BDM209B dual-mode Bluetooth® module

BDE-3P-BDM209B

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Overview

BDE-BDM209B is a Bluetooth 5.1 Basic Rate (BR), Enhanced Data Rate (EDR) and Low Energy (LE) Dual-Mode module.

The module offers Bluetooth Classic and Bluetooth LE radio (CC2564C) from Texas Instruments (TI) and an ultra-low-power Arm® Cortex®-M4 32-bit MCU (STM32L431). It integrates all required external components, including level shifters, clocks, power supply, band-pass filter, and antenna.

The module provides best-in-class RF performance with transmit power and receive sensitivity that offer twice the range and higher throughput compared to other Bluetooth LE-only solutions. The power management hardware and software algorithms deliver significant power savings in all commonly used BR/EDR and LE modes of operation.

The module comes with certified and royalty-free Dual-mode Bluetooth 5.1 protocol stack software. It provides complete Bluetooth BR/EDR and Bluetooth LE sample applications, reducing design effort and ensuring a faster time to market.

Features
  • Arm® 32-bit Cortex®-M4 CPU
    • FPU
    • ART accelerator
    • 80MHz frequency
  • Bluetooth 5.1 Dual-Mode
    • Bluetooth Basic Rate (BR)
    • Enhanced Data Rate (EDR)
    • Low Energy (LE)
  • Antenna option: integrated PCB trace antenna
  • Package
    • 12 x 22 x 2.1 mm
    • LCC-29
  • Certification
    • FCC
    • IC
    • CE-RED
    • Bluetooth
Wi-Fi products
CC2564C Bluetooth® Dual Mode transceiver qualified against Bluetooth Core 5.1
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Photos courtesy of BDE Technology Inc.

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Daughter card

BDE-BDM209B — Bluetooth 5.1 dual-mode based on CC2564C and STM32L431

Supported products & hardware

BDE-BDM209B Bluetooth 5.1 dual-mode based on CC2564C and STM32L431

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Release date:
TI's Standard Terms and Conditions for Evaluation Items apply.

Support & training

Third-party support
TI does not offer ongoing direct design support for this hardware. For support while working through your design, contact BDE Technology Inc..
Disclaimer

Certain information and resources (including links to non-TI sites) above may be provided by a third-party partner, and is included here merely for your convenience. TI is not the provider of, and is not responsible for, the content of such information and resources, and you should evaluate them carefully for your intended uses and on your own behalf. The inclusion of such information and resources here does not imply endorsement of any third-party company by TI, and shall not be construed as a warranty or representation regarding the suitability of any third-party products or services, either alone or in combination with any TI product or service.