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BDE-3P-CC2755R10-MODULES

BDE CC2755R10 modules with PCB antenna, UFL connector, RF PIN and 105℃ working temp

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BDE-3P-CC2755R10-MODULES

From: BDE Technology Inc.
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Overview

The BDE-MP2755R10 series are compact, cost-effective 2.4GHz multiprotocol wireless MCU modules powered by TI’s CC2755R10 single-chip MCU. Featuring an Arm Cortex-M33 processor and a qualified Bluetooth® 6.0 stack, they operate as standalone units without requiring an external MCU. They support Bluetooth 6.0 Low Energy, Zigbee 3.0, Thread 1.3, Matter 1.2, and proprietary protocols.

Designed for rapid integration, the modules incorporate integrated antennas, filters, and dual clocks. They delivers robust RF performance with up to +10dBm transmit power and -103.5dBm sensitivity (125kbps BLE Coded PHY), alongside advanced BLE 6.0 features like Channel Sounding and high-precision distance ranging. Ultra-low standby current, RTC support, and full 162KB RAM retention maximize battery life for low-duty-cycle devices. Pre-certified (FCC, ISED, CE, Bluetooth SIG) with secure OAD updates, they are ideal for smart home, industrial automation, medical, and consumer electronics applications.

Features
  • Bluetooth 6.0 qualified: Full support for Bluetooth 6.0 features, including long-range Coded PHYs, high-speed 2Mbit PHYs, advertising extensions, and up to 32 concurrent multirole connections.
  • Hardware accelerated Channel Sounding: Features a dedicated Algorithm Processing Unit (APU) to execute signal processing (FFT, super-resolution algorithms like MUltiple SIgnal Classification (MUSIC), and neural networks).
  • Multiprotocol wireless engine: Supports Bluetooth 6.0 Low Energy, Zigbee 3.0, Thread 1.3, Matter 1.2, and proprietary protocols.
  • Robust RF power & sensitivity: TX output power up to +10dBm and receiver sensitivity up to -103.5dBm on 125kbps BLE Coded PHY.
  • Ultra-low power management: Consumes an extremely low 0.9µA standby current with active Real-Time Clock (RTC) and full 162KB SRAM retention, dropping down to 160nA in complete shutdown.
  • Lots of memory: Packed with 1MB of Flash and 162KB of RAM. Optional additional 32Mbit flash.
  • Flexible antenna Options: Supports integrated PCB trace antenna, U.FL connector and ANT pin.
  • Pre-certified: FCC, IC, CE and Bluetooth SIG certified. Enables fast time to market.

  • BDE-MP2755R10A32: PCB Trace Antenna, 32Mbit SPI Flash, up to +85℃ operating
  • BDE-MP2755R10U32: U.FL Connector, 32Mbit SPI Flash, up to +85℃ operating
  • BDE-MP2755R10N32: ANT Pin, 32Mbit SPI Flash, up to +85℃ operating
  • BDE-MP2755R10A0: PCB Trace Antenna, up to +85℃ operating
  • BDE-MP2755R10U0: U.FL Connector, up to +85℃ operating
  • BDE-MP2755R10N0: ANT Pin, up to +85℃ operating
  • BDE-MP2755R10A32-IN: PCB Trace Antenna, 32Mbit SPI Flash, up to +105℃ operating
  • BDE-MP2755R10U32-IN: U.FL Connector, 32Mbit SPI Flash, up to +105℃ operating
  • BDE-MP2755R10N32-IN: ANT Pin, 32Mbit SPI Flash, up to +105℃ operating
  • BDE-MP2755R10A0-IN: PCB Trace Antenna, up to +105℃ operating
  • BDE-MP2755R10U0-IN: U.FL Connector, up to +105℃ operating
  • BDE-MP2755R10N0-IN: ANT Pin, up to +105℃ operating
Low-power 2.4-GHz products
CC2755R10 — Bluetooth, Zigbee, Thread and Matter wireless MCU with Edge AI NPU, HSM, 1MB flash and +10dBm
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BDE-MP2755R10 — BDE CC2755R10 modules with PCB antenna (A), UFL connector (U), RF PIN (N), 105℃ working temp (-IN)

Supported products & hardware

BDE-MP2755R10 — BDE CC2755R10 modules with PCB antenna (A), UFL connector (U), RF PIN (N), 105℃ working temp (-IN)

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TI does not offer ongoing direct design support for this hardware. For support while working through your design, contact BDE Technology Inc..

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