TIPA-010000

Power delivery architecture for AMD® Ultrascale+™ MPSoC proof of concept

TIPA-010000

Design files

Overview

This design guide proposes power tree concept reference designs surrounding an Advanced Micro Devices® (AMD) Ultrascale+™ Multi-Processor System-on-Chip (MPSoC) Field-Programmable Gate Array (FPGA). The power trees leverage newer TI modules and MagPack™ technology to minimize size on constrained boards while maintaining competitive efficiency, performance, and cost.

Features
  • Common input voltage (12V and 5V) power trees
  • Compact power trees achieves down to 159mm2 total size
  • Leverages MagPack™ technology and TI’s newest power modules
  • Up to 90% efficiency
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

PDF | HTML
TIDUFI1.PDF (358 KB)

Reference design overview and verified performance test data

Products

Includes TI products in the design and potential alternatives.

Power modules (integrated inductor)

TPSM843B224-V to 18-V input, advanced current mode, 20-A synchronous SWIFT™ step-down power module

Data sheet: PDF | HTML
Power modules (integrated inductor)

TPSM8F74204V to 17V, current mode, quad 4A stackable step-down power module

Data sheet: PDF | HTML
Power modules (integrated inductor)

TPSM8287A15M6V Input, 15A parallelable DC-DC buck module with I2C, frequency synch, remote sense and ET-grade

Data sheet: PDF | HTML
Power modules (integrated inductor)

TPSM828166-V 6-A step-down module with optional frequency synchronization, adjustable soft-start and tracking

Data sheet: PDF | HTML

Technical documentation

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* Design guide Power Delivery Architecture for AMD® Ultrascale+™ MPSoC PDF | HTML Apr 7, 2026

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