TI 不会为此硬件提供持续且直接的设计支持。要在设计期间获得支持，请联系 Shenzhen Shengrun Technology Co., Ltd..
TTC-3P-CC3300-WIFI-MODULE
TTC HY-330001 WIFI 6 module support any processor or MCU host capable of running a TCP/IP stack
TTC-3P-CC3300-WIFI-MODULE
概述
TTC focus on the wireless communication technology and applications for many years, specializing in the application of product protocol stacks such as BLE, WIFI, NFC, Zigbee, Thread, system compatibility, multi-device interconnectivity, comprehensive role applications, and complex positioning algorithms.
The HY-330001 module is based on TI CC3300 as the core design of a Wi-Fi® 6 wireless module. Wi-Fi supports IEEE 802.11b/g/n/ax MAC, baseband and RF transceivers, 2.4GHz, 20MHz, single-space streaming, hardware-based encryption and decryption, supports WPA2 and WPA3, supports 4-bit SDIO host interface, and application throughput up to 50Mbps. The module is packaged with a 44PIN stamp hole. The size is 12*12*2.5mm including shielding cover.
特性
- Wi-Fi 6 (802.11ax);
- Companion IC to any processor or MCU host capable of running a TCP/IP stack;
- Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power;
- Operating temperature: -40°C to +105°C;
- Application throughput up to 50 Mbps.
Wi-Fi 产品
照片提供方为 Shenzhen Shengrun Technology Co., Ltd.
支持与培训
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免责声明
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