SLVSAC2G August 2010 – June 2021 TPD2EUSB30 , TPD2EUSB30A , TPD4EUSB30
PRODUCTION DATA
The TPD2EUSB30, TPD2EUSB30A, and TPD4EUSB30 are 2 and 4 channel Transient Voltage Suppressor (TVS) based Electrostatic Discharge (ESD) protection diode arrays. The TPDxEUSB30/A devices are rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Contact). These devices also offer 5 A (8/20 μs) peak pulse current ratings per IEC 61000-4-5 (Surge) specification.
The TPD2EUSB30A offers low 4.5-V DC break-down voltage. The low capacitance, low break-down voltage, and low dynamic resistance make the TPD2EUSB30A a superior protection device for high-speed differential IOs.
The TPD2EUSB30 and TPD2EUSB30A are offered in space saving DRT (1 mm × 1 mm) package. The TPD4EUSB30 is offered in space saving DQA (2.5 mm × 1.0 mm) package.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TPD2EUSB30 | SOT (3) | 1.00 mm × 0.80 mm |
TPD2EUSB30A | ||
TPD4EUSB30 | USON (10) | 2.50 mm × 1.00 mm |
Changes from Revision F (October 2015) to Revision G (June 2021)
Changes from Revision E (August 2014) to Revision F (October 2015)
Changes from Revision D (August 2012) to Revision E (July 2014)
Changes from Revision C (December 2011) to Revision D (August 2012)
Changes from Revision B (July 2011) to Revision C (December 2011)
Changes from Revision A (December 2010) to Revision B (July 2011)
Changes from Revision * (August 2010) to Revision A (December 2010)
PIN | TYPE | DESCRIPTION | ||
---|---|---|---|---|
NAME | DRT | DQA | ||
D1+ | 1 | 1 | ESD port | High-speed ESD clamp, provides ESD protection to the high-speed differential data lines. |
D1– | 2 | 2 | ||
D2+ | — | 4 | ||
D2– | — | 5 | ||
GND | 3 | 3, 8 | GND | Ground |
N.C. | — | 6, 7, 9, 10 |
— | Not normally connected |
MIN | MAX | UNIT | ||||
---|---|---|---|---|---|---|
IO voltage (D+ and D- pins) | TPD2EUSB30, TPD4EUSB30 | 0 | 6 | V | ||
TPD2EUSB30A | 0 | 4 | ||||
IEC 61000-4-5 surge current (tp = 8/20 μs) | D+, D– pins | 5 | A | |||
IEC 61000-4-5 surge peak power (tp = 8/20 μs) | D+, D– pins | 45 | W | |||
TA | Operating free-air temperature | –40 | 85 | °C | ||
Tstg | Storage temperature | –65 | 125 | °C |
VALUE | UNIT | ||||
---|---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) | 2500 | V | |
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) | 1500 | ||||
IEC 61000-4-2 Contact Discharge | D+, D– pins | 8000 | |||
IEC 61000-4-2 Air-Gap Discharge (TPD2EUSB30/A) | D+, D– pins | 8000 | |||
IEC 61000-4-2 Air-Gap Discharge (TPD4EUSB30) | D+, D– pins | 9000 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
TA operating free-air temperature | –40 | 85 | °C | |
Operating Voltage | TPD2EUSB30, TPD4EUSB30 | 0 | 5.5 | V |
TPD2EUSB30A | 0 | 3.6 |
THERMAL METRIC(1) | TPD2EUSB30 | TPD2EUSB30A | TPD4EUSB30 | UNIT | |
---|---|---|---|---|---|
DRT (SOT) | DRT (SOT) | DQA (USON) | |||
3 PINS | 3 PINS | 10 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 610.2 | 610.2 | 162.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 288.0 | 288.0 | 128.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 118.4 | 118.4 | 56.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 20.2 | 20.2 | 13.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 116.4 | 116.4 | 56.6 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | 8.1 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
VRWM | Reverse stand-off voltage (D+ and D- pins) | TPD2EUSB30, TPD4EUSB30 | 5.5 | V | |||
TPD2EUSB30A | 3.6 | V | |||||
Vclamp | Clamp voltage | D+,D– pins to ground, | IIO = 1 A | 8 | V | ||
IIO | Current from IO port to supply pins | VIO = 2.5 V, | ID = 8 mA | 0.01 | 0.1 | μA | |
VD | Diode forward voltage | D+,D– pins, lower clamp diode, | VIO = 2.5 V, ID = 8 mA | 0.6 | 0.8 | 0.95 | V |
Rdyn | Dynamic resistance | D+,D– pins | I = 1 A | 0.6 | Ω | ||
CIO-IO | Capacitance IO to IO | D+,D– pins | VIO = 2.5 V; ƒ = 100 kHz | 0.05 | pF | ||
CIO-GND | Capacitance IO to GND | D+,D– pins (DRT) | VIO = 2.5 V; ƒ = 100 kHz | 0.7 | pF | ||
D1+, D1-, D2+, D2- (DQA ) | 0.8 | ||||||
VBR | Break-down voltage, TPD2EUSB30, TPD4EUSB30 | IIO = 1 mA | 7 | V | |||
Break-down voltage, TPD2EUSB30A | IIO = 1 mA | 4.5 | V |