Product details

Package name SOT-9X3 Peak pulse power (8/20 μs) (max) (W) 45 Vrwm (V) 5.5 Bi-/uni-directional Uni-Directional Number of channels 2 IO capacitance (typ) (pF) 0.7 IEC 61000-4-2 contact (±V) 8000 IEC 61000-4-5 (A) 5 Clamping voltage (V) 8 Dynamic resistance (typ) 0.6 Interface type USB 3.0 Breakdown voltage (min) (V) 7 IO leakage current (max) (nA) 100 Rating Catalog Operating temperature range (°C) -40 to 85
Package name SOT-9X3 Peak pulse power (8/20 μs) (max) (W) 45 Vrwm (V) 5.5 Bi-/uni-directional Uni-Directional Number of channels 2 IO capacitance (typ) (pF) 0.7 IEC 61000-4-2 contact (±V) 8000 IEC 61000-4-5 (A) 5 Clamping voltage (V) 8 Dynamic resistance (typ) 0.6 Interface type USB 3.0 Breakdown voltage (min) (V) 7 IO leakage current (max) (nA) 100 Rating Catalog Operating temperature range (°C) -40 to 85
SOT-9X3 (DRT) 3 1 mm² 1 x 1
  • Supports USB 3.0 data rates (5 Gbps)
  • IEC 61000-4-2 ESD protection (level 4 contact)
  • IEC 61000-4-5 surge protection
    • 5 A (8/20 µs)
  • Low capacitance
    • DRT: 0.7 pF (typical)
    • DQA: 0.8 pF (typical)
  • Dynamic resistance: 0.6 Ω (typical)
  • Space-saving DRT, DQA packages
  • Flow-through pin mapping
  • Supports USB 3.0 data rates (5 Gbps)
  • IEC 61000-4-2 ESD protection (level 4 contact)
  • IEC 61000-4-5 surge protection
    • 5 A (8/20 µs)
  • Low capacitance
    • DRT: 0.7 pF (typical)
    • DQA: 0.8 pF (typical)
  • Dynamic resistance: 0.6 Ω (typical)
  • Space-saving DRT, DQA packages
  • Flow-through pin mapping

The TPD2EUSB30, TPD2EUSB30A, and TPD4EUSB30 are 2 and 4 channel Transient Voltage Suppressor (TVS) based Electrostatic Discharge (ESD) protection diode arrays. The TPDxEUSB30/A devices are rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Contact). These devices also offer 5 A (8/20 µs) peak pulse current ratings per IEC 61000-4-5 (Surge) specification.

The TPD2EUSB30A offers low 4.5-V DC break-down voltage. The low capacitance, low break-down voltage, and low dynamic resistance make the TPD2EUSB30A a superior protection device for high-speed differential IOs.

The TPD2EUSB30 and TPD2EUSB30A are offered in space saving DRT (1 mm × 1 mm) package. The TPD4EUSB30 is offered in space saving DQA (2.5 mm × 1.0 mm) package.

The TPD2EUSB30, TPD2EUSB30A, and TPD4EUSB30 are 2 and 4 channel Transient Voltage Suppressor (TVS) based Electrostatic Discharge (ESD) protection diode arrays. The TPDxEUSB30/A devices are rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Contact). These devices also offer 5 A (8/20 µs) peak pulse current ratings per IEC 61000-4-5 (Surge) specification.

The TPD2EUSB30A offers low 4.5-V DC break-down voltage. The low capacitance, low break-down voltage, and low dynamic resistance make the TPD2EUSB30A a superior protection device for high-speed differential IOs.

The TPD2EUSB30 and TPD2EUSB30A are offered in space saving DRT (1 mm × 1 mm) package. The TPD4EUSB30 is offered in space saving DQA (2.5 mm × 1.0 mm) package.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 10
Type Title Date
* Data sheet TPDxEUSB30 2-, 4-Channel ESD Protection for Super-Speed USB 3.0 Interface datasheet (Rev. G) PDF | HTML 01 Jun 2021
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 11 Jan 2024
User guide Reading and Understanding an ESD Protection Data Sheet (Rev. A) PDF | HTML 19 Sep 2023
Application note Capacitance Requirements for High Speed Signals (Rev. A) PDF | HTML 21 Aug 2023
Selection guide System-Level ESD Protection Guide (Rev. D) 07 Sep 2022
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 18 Aug 2022
Application note ESD Protection Layout Guide (Rev. A) PDF | HTML 07 Apr 2022
User guide Generic ESD Evaluation Module User's Guide (Rev. A) PDF | HTML 27 Sep 2021
White paper Designing USB for short-to-battery tolerance in automotive environments 10 Feb 2016
Analog Design Journal Design Considerations for System-Level ESD Circuit Protection 25 Sep 2012

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ESDEVM — ESD evaluation module

The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested. For typical (...)
User guide: PDF | HTML
Not available on TI.com
Reference designs

TIDA-01589 — High fidelity, near-field two-way audio reference design with noise reduction and echo cancellation

Man machine interaction requires an acoustic interface for providing full duplex hands-free communication. In hands-free mode, part of the far-end or near-end audio signal from the speaker is coupled to the microphones. Furthermore, in noisy environments the microphones also capture ambient noise (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-010057 — Ultrasound smart probe power supply reference design

Significant technological advancements and high degree of integration in Medical imaging, especially hand-held ultrasound smart probes, are pushing engineers to come up with highly-efficient, noise immune power solutions in a small size. This reference design documents end to end power and data (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDEP-0075 — Industrial Communications Gateway PROFINET IRT to PROFIBUS Master Reference Design

PROFINET is becoming the leading industrial Ethernet protocol in automation due to its high-speed, deterministic communications and enterprise connectivity. However, as the world’s most popular fieldbus, PROFIBUS’s importance and usage will continue for many years due to legacy (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDEP0078 — OPC UA Data Access Server for AM572x Reference Design

OPC UA is an industrial machine-to-machine protocol designed to allow interoperability and communication between all machines connected under Industry 4.0. This reference design demonstrates use of the Matrikon OPC™ OPC UA server development kit (SDK) to allow communications using an OPC UA (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-00148 — USB 2.0/3.0 mass storage bridge for automotive infotainment systems

This TIDA-00148 reference design features the TUSB9261DEMO which allows quick evaluation of system compatibility for connections to SATA devices used for automotive infotainment systems. The firmware used in TIDA-00148 is capable of supporting a single SATA drive such as a solid state drive, hard (...)
Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
SOT-9X3 (DRT) 3 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos