Product details

Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 180 CON (typ) (pF) 30 ON-state leakage current (max) (µA) 0.022 Supply current (typ) (µA) 0.14 Bandwidth (MHz) 150 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection, Powered-off protection Input/output continuous current (max) (mA) 5 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -48
Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 180 CON (typ) (pF) 30 ON-state leakage current (max) (µA) 0.022 Supply current (typ) (µA) 0.14 Bandwidth (MHz) 150 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection, Powered-off protection Input/output continuous current (max) (mA) 5 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -48
TSSOP (PW) 20 41.6 mm² 6.5 x 6.4 WQFN (RTJ) 20 16 mm² 4 x 4
  • Wide supply range:
    • Dual supply: ±5 V to ±22 V
    • Single supply: 8 V to 44 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Power-off protection: ±60 V
    • Adjustable overvoltage triggering thresholds
      • V FP: 3 V to V DD, V FN: 0 V to V SS
    • Interrupt flags to indicate overall and specific fault channel information
    • Non-fault channels continue to operate with low leakage currents
    • Output clamped to the fault supply in overvoltage condition
  • Latch-up immunity by device construction
  • Logic capable: 1.8-V
  • Fail-safe logic: up to 44 V independent of supply
  • Break-before-make switching
  • Industry-standard TSSOP and smaller WQFN package
  • Wide supply range:
    • Dual supply: ±5 V to ±22 V
    • Single supply: 8 V to 44 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Power-off protection: ±60 V
    • Adjustable overvoltage triggering thresholds
      • V FP: 3 V to V DD, V FN: 0 V to V SS
    • Interrupt flags to indicate overall and specific fault channel information
    • Non-fault channels continue to operate with low leakage currents
    • Output clamped to the fault supply in overvoltage condition
  • Latch-up immunity by device construction
  • Logic capable: 1.8-V
  • Fail-safe logic: up to 44 V independent of supply
  • Break-before-make switching
  • Industry-standard TSSOP and smaller WQFN package

The TMUX7348F and TMUX7349F are modern complementary metal-oxide semiconductor (CMOS) analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as V DD = 12 V, V SS = –5 V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX7348F and TMUX7349F devices suitable for applications where power supply sequencing cannot be precisely controlled.

The device blocks fault voltages up to +60 V and –60 V relative to ground in both powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of switch input conditions and logic control status. Under normal operation conditions, if the analog input signal level on any Sx pin exceeds positive fault supply (V FP) or negative fault supply (V FN) by a threshold voltage (V T), then the channel turns OFF and the Sx pin becomes high impedance. When the fault channel is selected, the drain pin (D or Dx) is pulled to the fault supply voltage (V FP or V FN) that was exceeded. The devices provide two active-low interrupt flags (FF and SF) to provide details of the fault. The FF flag indicates if any of the source inputs are experiencing a fault condition, while the SF flag is used to decode which specific inputs are experiencing a fault condition.

The low capacitance, low charge injection, and integrated fault protection enables the TMUX7348F and TMUX7349F devices to be used in front end data acquisition applications where high performance and high robustness are both critical. The devices are available in standard TSSOP package and smaller WQFN package (ideal if PCB space is limited).

The TMUX7348F and TMUX7349F are modern complementary metal-oxide semiconductor (CMOS) analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as V DD = 12 V, V SS = –5 V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX7348F and TMUX7349F devices suitable for applications where power supply sequencing cannot be precisely controlled.

The device blocks fault voltages up to +60 V and –60 V relative to ground in both powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of switch input conditions and logic control status. Under normal operation conditions, if the analog input signal level on any Sx pin exceeds positive fault supply (V FP) or negative fault supply (V FN) by a threshold voltage (V T), then the channel turns OFF and the Sx pin becomes high impedance. When the fault channel is selected, the drain pin (D or Dx) is pulled to the fault supply voltage (V FP or V FN) that was exceeded. The devices provide two active-low interrupt flags (FF and SF) to provide details of the fault. The FF flag indicates if any of the source inputs are experiencing a fault condition, while the SF flag is used to decode which specific inputs are experiencing a fault condition.

The low capacitance, low charge injection, and integrated fault protection enables the TMUX7348F and TMUX7349F devices to be used in front end data acquisition applications where high performance and high robustness are both critical. The devices are available in standard TSSOP package and smaller WQFN package (ideal if PCB space is limited).

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Technical documentation

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Type Title Date
* Data sheet TMUX734xF ±60-V Fault-Protected, 8:1 and Dual 4:1 Multiplexers With Adjustable Fault Threshold, Latch-Up Immunity, and 1.8-V Logic datasheet (Rev. B) PDF | HTML 13 Jul 2023
Application brief How to Protect a Multi-Channel RTD System using Fault Protected Multiplexers (Rev. A) PDF | HTML 08 Aug 2024
Application note Protecting and Maintaining Signal Integrity in PLC Systems (Rev. A) PDF | HTML 22 Jul 2024
Application note How to Handle High Voltage Common Mode Applications using Multiplexers PDF | HTML 03 Oct 2022

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TMUX-24PW-EVM — TMUX generic evaluation module for 16-, 20- and 24-pin PW thin shrink small-outline packages (TSSOP)

The TMUX-24PW-EVM evaluation module allows for the quick prototyping and DC characterization of the TI line of TMUX products that use 16-, 20- or 24-pin TSSOP packages (PW) and is rated for high-voltage operation.

User guide: PDF | HTML
Not available on TI.com
Evaluation board

TMUXRTJ-RRQEVM — Generic TMUX evaluation module for 20-pin RTJ and RRQ QFN package

The TMUXRTJ-RRQEVM allows for the quick prototyping and DC characterization of TI's line of TMUX products that use 20-pin RTJ or RRQ packages (QFN) and is rated for high voltage operation.

User guide: PDF | HTML
Not available on TI.com
Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
Not available on TI.com
Simulation model

TMUX7348F IBIS Model

SCDM285.ZIP (50 KB) - IBIS Model
Simulation model

TMUX7348F PSPICE Model

SCDM313.ZIP (124 KB) - PSpice Model
Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 20 Ultra Librarian
WQFN (RTJ) 20 Ultra Librarian

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