ADS8383 处于停产状态
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功能与比较器件相同,但引脚排列有所不同
ADS8912B 正在供货 具有内部 VREF 缓冲器、内部 LDO 和增强型 SPI 接口的 18 位、500kSPS、单通道 SAR ADC Different interface (SPI)

产品详情

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TQFP (PFB) 48 81 mm² 9 x 9
  • 500-kHz Sample Rate
  • 18-Bit NMC Ensured Over Temperature
  • Zero Latency
  • Low Power: 110 mW at 500 kHz
  • Unipolar Input Range
  • Onboard Reference Buffer
  • High-Speed Parallel Interface
  • Wide Digital Supply
  • 8-/16-/18-Bit Bus Transfer
  • 48-Pin TQFP Package
  • APPLICATIONS
    • Medical Instruments
    • Optical Networking
    • Transducer Interface
    • High Accuracy Data Acquisition Systems
    • Magnetometers

  • 500-kHz Sample Rate
  • 18-Bit NMC Ensured Over Temperature
  • Zero Latency
  • Low Power: 110 mW at 500 kHz
  • Unipolar Input Range
  • Onboard Reference Buffer
  • High-Speed Parallel Interface
  • Wide Digital Supply
  • 8-/16-/18-Bit Bus Transfer
  • 48-Pin TQFP Package
  • APPLICATIONS
    • Medical Instruments
    • Optical Networking
    • Transducer Interface
    • High Accuracy Data Acquisition Systems
    • Magnetometers

The ADS8383 is an 18-bit, 500 kHz A/D converter. The device includes a 18-bit capacitor-based SAR A/D converter with inherent sample and hold. The ADS8383 offers a full 18-bit interface, a 16-bit option where data is read using two read cycles or even an 8-bit bus using three read cycles.

The ADS8383 is available in a 48-lead TQFP package and is characterized over the industrial –40°C to 85°C temperature range.

The ADS8383 is an 18-bit, 500 kHz A/D converter. The device includes a 18-bit capacitor-based SAR A/D converter with inherent sample and hold. The ADS8383 offers a full 18-bit interface, a 16-bit option where data is read using two read cycles or even an 8-bit bus using three read cycles.

The ADS8383 is available in a 48-lead TQFP package and is characterized over the industrial –40°C to 85°C temperature range.

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 18-Bit, 500-kHz, Unipolar Input, Micropower Sampling ADC Converter 数据表 (Rev. C) 2005年 2月 14日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点